MTE Manager(职位编号：825972)
微软亚洲硬件中心 （MACH）
- 公司规模：500-1000人
- 公司性质：外资(欧美)
- 公司行业：计算机硬件 计算机软件
职位信息
- 发布日期：2013-03-26
- 工作地点：深圳
- 招聘人数：1
- 工作经验：十年以上
- 学历要求：本科
- 语言要求：英语熟练
普通话熟练 - 职位类别：技术支持/维护经理
职位描述
Job ID 825972
Location China, Shenzhen
Job Category Hardware Engineering
Division Interactive Entertainment Business
JOB FUNCTIONS:
- Lead PM, Mfg Test Engineers, Hardware Engineer, Software Dev Engineer and ICT Engineer in carry out daily routine task, both sustaining in hardware and software.
- Responsible for Manufacturing Test Engineering leadership in support and sustaining of production test systems and test processes in a very high volume contract manufacturing environment.
- Daily monitoring of test data trends, test yield, false failure in order to improve overall manufacturing and product quality and processes.
- Responsible in real time audits of test systems and test processes at all Tier 1 sites to ensure test and quality adherence and compliance as prescribed in the statement of work and Engineering Change Orders and Test Procedures.
- Provide onsite test support to all Tier 1 suppliers for all future EVT, DVT, and PVT builds.
- Provide program management support to test suite build, test control system, ARM, and ICT deployment.
- Work with US team on test equipment hardware development, board level and system design and SW development.
- Manage all Tier 1 test systems maintenance, including spare parts procurement, GR&R and test systems and tool qualification procedures.
- Assist in resolving test quality and systems related issues to avoid production downtime and impact to product quality, may provide guidance to Tier 1 Test Engineering personnel.
- Create/verify/audit test systems bill of materials, manufacturing test procedures and standard of operations manual for overall manufacturing test eco system.
- Assist new Tier 1 suppliers in preparation and readiness for manufacturing qualification.
- Manage all tier 1 test process improvements and cost reduction projects related to manufacturing testing.
- Be the front line interface with CM for sustaining test HW/SW/test process technical issues.
- Drive for test HW continuous improvement in term of efficiency, downtime, yield, false failure and cost.
- Lead and organize team to develop strategy to resolve a wide range of difficult and complex problems, increase test productivity and UPH.
- Review OBA test failure and work with PE/dev team in improving test coverage.
- Prepares weekly status report to Manufacturing Test Management.
- Work closely with the local factory manager and Tier 1 Test Eng/Program Managers to improve quality and manufacturing efficiencies.
KNOWLEDGE, SKILLS AND ABILITIES:
- A Bachelor of Science Degree in Electrical Engineering, Electronic Technology, computer or equivalent field of studies.
- A minimum of 10 years’ experience in Test Engineering and Management, Technical Program Management or comparable related industry experience.
- Knowledge in manufacturing test process development and related documentations.
- Knowledge in test development in both HW and SW development for test equipment.,
- Experience using Microsoft Office and Windows Operating Systems, C#, C++, labview, JMP, minitab, Microsoft Share point Technology and SQL.
- A strong verbal and written communication skill is a must along with good interpersonal skills. Fluent in technical English. Mandarin and Cantonese skills a plus.
- Knowledge of manufacturing processes and quality data systems and data collections.
- Knowledge of SPC and prior working experience with automated test equipment is desirable.
- Familiarity with ICT test (Agilent 3070), PCBA board functional test methods, systems level testing.
- Understanding of physical and electrical failure analysis flows.
- Familiarity of very high volume production environment and contract manufacturing.
PHYSICAL REQUIREMENTS:
- Ability to travel frequently overseas and for extended period of time and on short notices.
- Job location at Microsoft Asia Center for Hardware (MACH) in Guangdong, Shenzhen or Suzhou; and will be supporting the manufacturing facilities located in the Guangdong Province or Suzhou.
Microsoft is an equal opportunity employer and supports workforce diversity.
GCR:CN:DEV:EN
Location China, Shenzhen
Job Category Hardware Engineering
Division Interactive Entertainment Business
JOB FUNCTIONS:
- Lead PM, Mfg Test Engineers, Hardware Engineer, Software Dev Engineer and ICT Engineer in carry out daily routine task, both sustaining in hardware and software.
- Responsible for Manufacturing Test Engineering leadership in support and sustaining of production test systems and test processes in a very high volume contract manufacturing environment.
- Daily monitoring of test data trends, test yield, false failure in order to improve overall manufacturing and product quality and processes.
- Responsible in real time audits of test systems and test processes at all Tier 1 sites to ensure test and quality adherence and compliance as prescribed in the statement of work and Engineering Change Orders and Test Procedures.
- Provide onsite test support to all Tier 1 suppliers for all future EVT, DVT, and PVT builds.
- Provide program management support to test suite build, test control system, ARM, and ICT deployment.
- Work with US team on test equipment hardware development, board level and system design and SW development.
- Manage all Tier 1 test systems maintenance, including spare parts procurement, GR&R and test systems and tool qualification procedures.
- Assist in resolving test quality and systems related issues to avoid production downtime and impact to product quality, may provide guidance to Tier 1 Test Engineering personnel.
- Create/verify/audit test systems bill of materials, manufacturing test procedures and standard of operations manual for overall manufacturing test eco system.
- Assist new Tier 1 suppliers in preparation and readiness for manufacturing qualification.
- Manage all tier 1 test process improvements and cost reduction projects related to manufacturing testing.
- Be the front line interface with CM for sustaining test HW/SW/test process technical issues.
- Drive for test HW continuous improvement in term of efficiency, downtime, yield, false failure and cost.
- Lead and organize team to develop strategy to resolve a wide range of difficult and complex problems, increase test productivity and UPH.
- Review OBA test failure and work with PE/dev team in improving test coverage.
- Prepares weekly status report to Manufacturing Test Management.
- Work closely with the local factory manager and Tier 1 Test Eng/Program Managers to improve quality and manufacturing efficiencies.
KNOWLEDGE, SKILLS AND ABILITIES:
- A Bachelor of Science Degree in Electrical Engineering, Electronic Technology, computer or equivalent field of studies.
- A minimum of 10 years’ experience in Test Engineering and Management, Technical Program Management or comparable related industry experience.
- Knowledge in manufacturing test process development and related documentations.
- Knowledge in test development in both HW and SW development for test equipment.,
- Experience using Microsoft Office and Windows Operating Systems, C#, C++, labview, JMP, minitab, Microsoft Share point Technology and SQL.
- A strong verbal and written communication skill is a must along with good interpersonal skills. Fluent in technical English. Mandarin and Cantonese skills a plus.
- Knowledge of manufacturing processes and quality data systems and data collections.
- Knowledge of SPC and prior working experience with automated test equipment is desirable.
- Familiarity with ICT test (Agilent 3070), PCBA board functional test methods, systems level testing.
- Understanding of physical and electrical failure analysis flows.
- Familiarity of very high volume production environment and contract manufacturing.
PHYSICAL REQUIREMENTS:
- Ability to travel frequently overseas and for extended period of time and on short notices.
- Job location at Microsoft Asia Center for Hardware (MACH) in Guangdong, Shenzhen or Suzhou; and will be supporting the manufacturing facilities located in the Guangdong Province or Suzhou.
Microsoft is an equal opportunity employer and supports workforce diversity.
GCR:CN:DEV:EN
公司介绍
微软亚洲硬件中心主要负责微软公司硬件产品的研发、设计、工程测试以及制造管理。从高精度光学跟踪定位芯片到新一代的触摸跟踪技术，从27M到2.4G无线技术，从出众的便携设计再到独特的人体工学设计，微软亚洲硬件中心坚持创新，为全球范围内的用户提供与众不同的经典硬件，给您带来便捷、精确、舒适的科技体验。
中心与微软美国雷德蒙总部人员密切协作，推进了微软硬件产品从概念设计到大规模生产的进程，并屡屡配合其他研发机构进行软硬件兼容性研发。其配备了世界顶尖级的专业硬件研发实验室，如 Xbox 工程实验室、PC 硬件工程实验室、EMC / 安全实验室、音频和视频实验室、以及制造测试设备实验室等.
针对客户持续提升的移动商务和娱乐需求，微软亚洲硬件中心的创新不仅体现于鼠标、键盘、摄像头、耳机、遥控器等 PC 外设方面，亦在 XBOX 360 和 Kinect的硬件研发方面，做出了重要的贡献。
从2004年成立至今，微软亚洲硬件中心已吸引了一批专注于硬件设计、工程设计、功能及基础测试、可靠性验证等技术领域的专家，建起了一支高素质的研发团队，旨在为全球硬件市场的创新与发展提供有力支持。在制造采购、供应商管理、新产品技术孵化等领域，微软亚洲硬件中心也发挥着重要的作用。
中心与微软美国雷德蒙总部人员密切协作，推进了微软硬件产品从概念设计到大规模生产的进程，并屡屡配合其他研发机构进行软硬件兼容性研发。其配备了世界顶尖级的专业硬件研发实验室，如 Xbox 工程实验室、PC 硬件工程实验室、EMC / 安全实验室、音频和视频实验室、以及制造测试设备实验室等.
针对客户持续提升的移动商务和娱乐需求，微软亚洲硬件中心的创新不仅体现于鼠标、键盘、摄像头、耳机、遥控器等 PC 外设方面，亦在 XBOX 360 和 Kinect的硬件研发方面，做出了重要的贡献。
从2004年成立至今，微软亚洲硬件中心已吸引了一批专注于硬件设计、工程设计、功能及基础测试、可靠性验证等技术领域的专家，建起了一支高素质的研发团队，旨在为全球硬件市场的创新与发展提供有力支持。在制造采购、供应商管理、新产品技术孵化等领域，微软亚洲硬件中心也发挥着重要的作用。