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Hardware Engineer 2(职位编号:814049)

微软亚洲硬件中心 (MACH)

  • 公司规模:500-1000人
  • 公司性质:外资(欧美)
  • 公司行业:计算机硬件  计算机软件

职位信息

  • 发布日期:2012-11-13
  • 工作地点:深圳
  • 招聘人数:1
  • 工作经验:五年以上
  • 学历要求:本科
  • 职位类别:硬件工程师  

职位描述

Job Category: Hardware Engineering
Location: China, Shenzhen
Job ID: 814049
Product: (Not Product Specific)
Division: Interactive Entertainment Business

Come build the future of consumer electronics at Microsoft. The DfX Engineering Team within the New Product Introduction (NPI) Organization is looking for a highly motivated, team-oriented DfX engineer to assist in the development, deployment and manufacturing of a world-class Design for X infrastructure within the Interactive Entertainment Business (IEB), Manufacturing, Finance, Supply Chain and Information Solutions (MSCIS) Group.

Scope of Responsibilities/Expectations

- DfX a critical component in the realization of the E2E concurrent engineering approach used for Microsoft hardware product development within IEB. Design for manufacturability, assembly, test, sourcing and reliability are a few of the many facets of DfX that are considered and managed as part of the development process. The focus of the DfX engineer within the NPI Organization is Design for Manufacturability and Design for Assembly.

- The DfX engineer is part of the NPI DfX Engineering Team which manages the integration of DfX activities into the hardware product development schedule; assuring that each product developed sets new standards in terms of quality, reliability, manufacturability and COG sensitivity.
- As a member of the overall NPI Organization, the DfX Engineer (Mechanical/Manufacturing) will be involved with any number of Microsoft hardware products under development from product groups such as Xbox, Xbox Accessories, Kinect, and Surface.
- The Dfx engineer will also partner with US based team and be responsible to support, manage, execute and provide status on activities initiated from US but are located in Asia. For example but not limited to; prototype builds, capability studies, process development and technology characterization work.
- The position requires a strong technical aptitude including an excellent understanding of DfX methodologies, high volume consumer electronics assembly processes, injection molding, materials and finishes, machine design and mechanics, tooling/jig/fixture design, component/fastener selection, test and inspection methodologies, quality assurance and consumer electronics product development
- This position reports to the DfX Manager and requires interaction with a wide range of disciplines both within IEB as well as with manufacturing partners outside of Microsoft.
- The successful candidate will be able to draw from industry experience to provide technical guidance, perform physical and statistical analysis, recommend and prepare design-of-experiments, characterize process/design interactions, review component and product design specifications, analyze mechanical design information and draft/edit specifications and technical guidelines.

Job Requirements

- BS/MS in Mechanical Engineering, Manufacturing Engineering, Industrial/Operations Engineering.
- 6+ years of automated, high volume manufacturing or mechanical engineering experience involving mechanical systems design and/or integration in the consumer electronics industry to include small form factor consumer electronic devices. Hands-on assembly process experience is mandatory.
- Knowledge of typical product level failure modes (production and field.) Ability to relate failure mode to process, material and design related stressors.
- Demonstrated experience working as a member of a product development engineering team, either as a hardware or as a manufacturing engineer where a systematic design for manufacturing, design for test, and design for service approach was used and/or adopted.
- Demonstrated experience in product/process characterization using techniques such as tolerance analysis, FEA, strain analysis, cost modeling, DOE, yield and defect data analysis.
- Demonstrated experience in root cause analysis of consumer electronics products using techniques such as FTA, Ishikawa, DFMEA, PFMEA and Cause Mapping.
- Frequent travel to factory sites is required.

Microsoft is an equal opportunity employer and supports workforce diversity.

GCR:CN:DEV:EN

公司介绍

  微软亚洲硬件中心主要负责微软公司硬件产品的研发、设计、工程测试以及制造管理。从高精度光学跟踪定位芯片到新一代的触摸跟踪技术,从27M到2.4G无线技术,从出众的便携设计再到独特的人体工学设计,微软亚洲硬件中心坚持创新,为全球范围内的用户提供与众不同的经典硬件,给您带来便捷、精确、舒适的科技体验。
  中心与微软美国雷德蒙总部人员密切协作,推进了微软硬件产品从概念设计到大规模生产的进程,并屡屡配合其他研发机构进行软硬件兼容性研发。其配备了世界顶尖级的专业硬件研发实验室,如 Xbox 工程实验室、PC 硬件工程实验室、EMC / 安全实验室、音频和视频实验室、以及制造测试设备实验室等.
  针对客户持续提升的移动商务和娱乐需求,微软亚洲硬件中心的创新不仅体现于鼠标、键盘、摄像头、耳机、遥控器等 PC 外设方面,亦在 XBOX 360 和 Kinect的硬件研发方面,做出了重要的贡献。
  从2004年成立至今,微软亚洲硬件中心已吸引了一批专注于硬件设计、工程设计、功能及基础测试、可靠性验证等技术领域的专家,建起了一支高素质的研发团队,旨在为全球硬件市场的创新与发展提供有力支持。在制造采购、供应商管理、新产品技术孵化等领域,微软亚洲硬件中心也发挥着重要的作用。