厦门招聘

Essential Functions:

Duties and responsibilities of this position include but are not limited to the following:

1. Write IOS. Determine package, pin-outs, process, application, cost, preliminary functions and EC specs, architecture, error source analysis, power consumption estimate, ESD.

2. Hold IOS meeting. Invite marketing, application and testing to the meeting. Have the IOS checklist signed.

3. Make a schedule plan.

4. Design and simulate circuits.

5. Make layout floor plan, determine power/ground bussing (including power bus width requirement and length estimate)

6. Write design review. In addition to circuit function and spec review, pay attention to ESD, latchup, breakdown, startup, floating node. Also include test method, trim method, characterization plan, and burn-in schematics if needed.

7. Hold design review meeting. Invite application and testing to the meeting. Have the design review checklist signed.

8. Obtain approved bonding diagrams and ensure die fits all packages and there is no thermal issue.

9. Work with layout to ensure die size, power buses, device matching, current density, ESD all are as required by designer.

10. Prepare tape out documents and do all the checks with layout designers.

11. Review masks.

12. Review demo board design.

13. Evaluate new product engineering samples. Generate evaluation report.

14. Characterize engineering samples at -40C, 25C and 125C for functions and EC specs. Generate 6-sigma summary.

15. Debug the design if there is function, spec or any other problem found in evaluation and characterization.

16. Decide whether a new revision is needed based on the evaluation and characterization, and application conditions.

17. Perform FTEC and provide final test limits to the test engineering.

18. Support test development including test method, hardware/software, and test debug. Review final test limits to improve yield with test engineer.

19. Review data sheet.

20. Report to design director or supervisor in all phases of the product development cycle.

21. Prepare and submit to DCC all documents related to each phase.

22. Initiate new product release as project leader.

23. Involved in training design interns.

Qualifications:

To perform this job successfully, an individual must be able to perform each essential duty satisfactorily. The requirements listed below are representative, but not limited to the knowledge, skill, and/or ability required.

·MSEE or BE Degree in related major

·2+years of experience in analog design

·Analog and mixed-signal design

·Proficient English communication ,both oral and written

    ISSI于1988年创立于美国硅谷，是全球领先的芯片设计公司。在中国台湾，美国，以色列，欧洲，韩国，日本，新加坡，印度等设有公司。并在北京、上海、厦门、武汉、苏州、深圳等地设有分公司、研发团队和办公室。2015年纳斯达克退市完成私有化，2020年成为北京君正的全资子公司。在大陆拥有：
矽成半导体（北京）
芯成半导体（上海）
矽恩微电子（厦门）
群茂科技 （武汉）

    从2016年起，ISSI连续5年斩获大奖，包括创新IC设计公司、年度***产品、杰出市场表现等奖项，2020年再度入选十大中国IC设计公司。

    凭借丰富的车规级芯片经验和丰富的行业经验及优异的产品质量，赢得了全球客户的认同。公司客户中不乏各行业的领军者，其中包括松下，博世，摩比斯，德尔福，大陆集团，江森自控，飞利浦，哈曼/贝克尔，SiriusXM，TRW，阿尔卡特朗讯，思科系统，爱立信，华为技术，诺基亚西门子网络，Tellabs，摩托罗拉， Garmin，LG电子，NEC，三星，夏普，索尼，东芝，Hypercom，GE，霍尼韦尔，雷蛇，施耐德电气，西门子和泰科。公司与客户共同探讨未来产品的路线图，根据客户需求开发高性能的芯片产品。

    ISSI提供DRAM，SRAM，Flash，Analog and Mixed-Signal products (混合信号芯片和通讯芯片等) 。专注于汽车电子和工业电子、通讯和消费电子等领域，拥有完全自主的芯片设计及专利知识产权。

    Lumissil Microsystem是隶属于ISSI旗下的模拟混合信号部门 (Analog and Mixed-Signal products), 近几年通过不断积极并购，整合优质技术，补充产品线，将主要聚焦在Lighting照明驱动，Connectivity连接芯片, Power电源芯片，Control控制驱动芯片等五大类高性能产品的开发和销售。

    更多信息可关注官网*******************或公众号 “Lumissil 智明微系统”。欢迎加入，共创中国芯！