西安招聘

Responsibility:
Responsible for IC package design (BGA, FlipChip and Wirebond) ) in accordance with industry standards and customers' specifications. Work with assembly team and substrate suppliers for spec review and provide technical consultation on substrate related issues as needed. Utilize package/die co-design tool for Design for Manufacturability. Work closely with the assembly sites to ensure that the design rules and standard notes are updated in consistent with the existing process manufacturability.

Requirements:
? Bachelor's Degree or above/Professional qualification in Mechanical/Materials, Electrical Engineering or 5 equivalent years of experience is acceptable;
? Knowledgeable of IC Package substrate fabrication and assembly;
? Design experience on flipchip and wirebond BGA substrates;
? Experience with Cadence Advanced Package Designer and AutoCad required, PCB Layout experience using Cadence Allegro will be considered;
? Geometric Dimensioning and Tolerancing proficiency required;
? Good English written and oral communication skills is required;
? Service oriented and able to work well with people at all levels with minimum supervision;
? Strong sense of ownership and responsibility;
? Good self-discipline & teamwork.

芯禾科技（xpeedic technology, inc.）创立2010年，致力于成为国内最好的面向世界的高性能电子设计自动化软件和设计服务的供应商。芯禾科技的创业团队包括电子设计自动化和光电设计业界有着丰富创业经验的***专家，他们已经在高速电路、无线射频、 数模混合电路、集成电路、封装设计等领域提供高质量的软件产品和设计服务。芯禾科技目前有风险投资公司的资金支持。

xpeedic technology, inc. was founded in 2010 by a team of industry experts to provide high performance eda software and differentiating electronic design engineering services. xpeedic is helping customers in the area of high speed digital designs, ic package designs, and rf analog mixed-signal designs. our engineering team has extensive experience in developing industry-leading eda software and has a proven track record for successfully delivering engineering service projects.
the company is backed by venture capital funding.