西安招聘

工作地点：上海

任职要求

- 微电子及相关专业，本科及以上学历，1年以上SOC-Encounter使用经验
- 理解ASIC后端设计流程
- 熟悉Tcl或Perl等脚本语言
- 熟悉Sign-off方法及STA, Noise, Power等方面EDA工具软件的使用
- 良好的口语及书面英语沟通能力

工作职责

- 模块和芯片级的物理实现，包括布局规划、布局布线、时钟树综合、时序和功耗分析等
- 在客户办公室从事物理实现项目
- 与芯片代工厂和IP供应商积极沟通IP引入和测试定义


Requirements:

- BSEE or above with 1+ years SOC-Encounter experience
- Good understanding of backend ASIC design flow
- Design automation and analysis using scripting languages, particular Tcl and Perl
- Solid knowledge on sign-off methodology and EDA tools for STA, Noise, Power, etc.
- Good verbal and written communication skills in English.

Responsibilities:

- Perform block level and full chip implementation including floor planning, P&R, CTS, timing and power analysis etc.
- Design consulting in customer's offices on physical implementation tasks
- Interfacing with foundry and IP providers on IP imports and test definition

Sondrel is a unique and trusted provider of high quality IC designs across multiple end markets. We offer our clients a turnkey service from system to silicon supply. Our designs have appeared in hundreds of leading-edge products including those of the market leaders in mobile phones, cameras, security systems, AR/VR systems, many more.

Founded in 2002 by CEO Graham Curren as a specialist IC design consultancy, today Sondrel provides both design consultancy and an end-to-end silicon solution from architecture and design through production and supply chain to the delivery of fully packaged and tested chips.

Operating from our design centres in UK, France, Morocco, China and India, with sales offices in Israel and the USA, our clients engage with us to create power efficient, highly performant products. Our success is based on delivering on our clients' requirements using our knowledge of how to get the most out of silicon and get it to market reliably, on time and at the right price.

Sondrel是一家为多个终端市场提供高质量的集成电路设计的供应商。我们为客户提供从系统到芯片的一站式服务。我们的设计已经出现在上百种前沿产品中，包括：手机、相机、安全系统、AR及VR等。

Sondrel作为一家集成电路设计咨询公司，于2002年由首席执行官Graham Curren创立。目前Sondrel提供设计咨询及端到端的芯片解决方案，即从架构设计到生产供应链，再到完整的封装测试的交付。

我们在英国、法国、摩洛哥、中国和印度都设有研发中心，在以色列和美国设有销售办事处，与客户合作，创造高效节能及高性能的产品。我们的成功基于满足客户的需求，及如何利用我们的知识***限度的利用芯片，使其可靠地、及时地、以正确的价格投放市场。