无锡招聘

Perform component/module level failure analysis for internal and external customers; generate written FA reports; interpretation and communication of analysis data from outside FA labs as well as coordination with subcontract labs for analytical services.

Job Requirement:
1.Expertize with failure analysis tools/equipments for its capability and machine operations.
2.Perform electrical and physical failure analysis on internal and external failure parts including wafers, probe, assembly and bumping process / customer returned modules to identify root causes.
3.Setup electrical bench testing for trouble shooting and failure mode confirmation as needed
4.Monitor and participate in effectiveness verifications for failure analysis findings.
5.Work with R&D, Product Engineer, FAE engineer as required to identify failure root cause and effective corrective and preventive actions.
6.Work with Reliability Engineer to support New Product, Package and Process qualification failures and regular reliability monitor and assessment
7.Expert with EDX/SEM machine operation and ability to use these machines.
8.Lead Failure Analysis project and provide complete Failure Analysis report.
9.Responsible for the co-ordination of analytical resources (include off-site as needed) to ensure rapid and accurate results

It Needs:
More than 10 years experience with hands-on failure analysis of semiconductor electronic components and IC's with all varieties of packaging.
Experienced in duplicating electronic or mechanical failure modes, troubleshooting to device level and performing electrical characterization.
Skilled at sample preparation, cross-sectioning, polarized light microscopy and x-ray analysis.
Chemical de-capsulation of electronic devices and hands-on experience with SEM, EDX, C-SAM, EMMI, FIB and other advance techniques required.
Experience with interpretation of application schematics and a background in semiconductor design and/or reliability a plus.
Previous experience with MEMS semiconductor technology highly desired
Strong interpersonal skills and ability to work effectively within a global matrixed team environment
Limited travel internationally may be required
Excellent English communication skills, (written, and verbal)
Strong attention to details, highly organized, computer literate
Ability to work well in a fast-paced professional office environment

美新半导体（MEMSIC）是全球领先的MEMS和传感技术解决方案供应商，美新的技术使现实世界和数字世界相联接，并通过感知物理世界的位移和运动变化，为人们提供更加智能、可靠和安全的科技体验。
      美新于1999年成立, 目前总部位于中国天津，在美国Andover、硅谷和中国无锡设有研发机构，在中国无锡拥有制造和封测工厂，销售网络遍及亚太，美洲，欧洲，非洲和中东等地区。
       2007年美新于在NASDAQ上市；
       2013年完成私有化，并在2017年底并入中国上市公司华灿光电；
       2019年12月底，正式从华灿光电独立，在天津成立美新半导体（天津）有限公司。
       2020年美新半导体完成了十余亿人民币A轮融资。
       2020年美新与MCube达成电容式MEMS传感器知识产权及技术授权，全面进入电容式加速度及陀螺仪领域，并把握住战略机遇，高效完成了电容式加速度计和陀螺仪的技术布局，依托自身强大的供应链整合能力，于年中后迅速实现电容式加速计产品每月10KK级以上稳定量产。美新半导体的陀螺仪技术也由此得到了突破性进展，并将成为美新半导体扩展产品线的下一重点突破。
       公司拥有近百项境内专利和近百项境外专利，是全球***一家能够生产基于热式MEMS加速度计的厂商，具备高抗冲击、低成本、高集成度等特点，特别适合工业、航空、汽车等高价值应用。而公司全球***的单一芯片电容式加速计技术，造就了全球功耗最低（0.1微安睡眠功耗）、面积最小的电容式加速度计产品，并灵活提供两种封装形式CSP（1.1x1.3***）和LGA(1.6x1.6***)，在移动电子市场具有超强的竞争力。公司也是全球主要的地磁产品供应商，已经向市场累计发货20亿颗地磁传感器，占有3成以上的市场份额。