武汉招聘

Key Responsibilities and Critical Success Measures

• Provide clear and concise metric reports that detail actions and owners to resolve all manufacturing related issues.
• Devise innovative methods of adding value through a close working relationship with Operational leadership onsite(s).
• Analyse and assess operational activities in order to identify areas for improvement across the site(s) and within the wider business.
• Manage the delivery of assigned capital equipment and transition into production.
• Negotiate, co-ordinate with contractors during problem resolving and agreed eliminate variations whilst obtaining most effective solution.
• Ensure all project activities are conducted within applicable legislation and in alignment with company policies and procedures.
• Propose new ways of working by using best practice in processes and technologies.
• Provide progress updates against assigned projects to the senior management, senior engineers, and identifying opportunities, risks and any remedial action plans required.
• Process monitoring and 1st line interaction of Wire Bonding, Die Attach, capping, CoC and other processes with the contractor.
• Work hand in hand with contractor management.
• Yield monitoring and improvement.
• New product introduction and qualification including coordinating Engineering builds.
• Review and reduction of production costing through process improvement, material changes and Yield improvement.

Essential Qualifications & Experience

• Degree level qualified (Electronics/Photonics/Manufacturing).
• Experience in using Project Management Methodologies.
• Knowledge of current health and safety/environmental compliance.
• 5 or more years experience of TO can assembly and measurement process including, Die Attach, Wire Bond, Capping etc.
• Familiar with Diode Fabrication and in TO-can Package testing and manufacturing process flow.

Desirable Qualifications & Experience

• Chartered Engineer or ability to work towards.
• Project Management Qualification.
• Optical experience with lasers or lens alignment techniques desirable.
• Experience of Leading Teams.
• Back-end Wafer processing, Lapping, polishing, Metal Evaporation, Rapid Thermal processing, Singulation, Die sort.

Functional Competencies
Deciding and Initiating Action

• Makes prompt, clear decisions which may involve tough choices or considered risks.
• Takes responsibility for actions, projects and people.
• Takes initiative, acts with confidence and works under own direction.
• Initiates and generates activity.

Relating and Networking

• Establishes good relationships with customers, contractors and staff.
• Builds wide and effective networks of contacts inside and outside the organisation.
• Relates well to people at all levels.
• Manages conflict.
• Work remotely.

Analysing

• Analyses numerical data, verbal data and all other sources of information.
• Probes for further information or greater understanding of a problem.
• Makes rational judgements from the available information and analysis.
• Produces workable solutions to a range of problems.
• Demonstrates an understanding of how one issue may be part of a much larger system.

Personal Characteristics

• Innovative individual who is able to influence others whilst having the resilience to pursue issues to a satisfactory conclusion without excessive guidance.
• Ability to achieve targets under pressure whilst managing conflicting priorities.
• Can demonstrate successfully the use of Problem solving techniques with an excellent attention to detail is essential.

* Salary In Negotiable

    As a global leader in the design and manufacture of high-performance semiconductor components, MACOM have more than 65 years of expertise in solving complex circuit design, packaging and manufacturing challenges. Over this time, MACOM has earned its stellar reputation by providing solutions to a broad range of complex RF and microwave challenges faced by top OEMs and systems integrators in a variety of markets—including cellular base stations and infrastructure, military communications, avionics, radar, medical equipment, point-to-point and broadband radios, and broadcast equipment. MACOM has design, Si and GaAs fabrication, manufacturing, assembly and test, and operational facilities in a number of geographies. We have many R&D centers located at Lowell, Massachusetts; Torrance, California; Cork, Ireland and Shenzhen, China, Australia Ireland. To focus on our customers’ requirements by providing excellent solutions and services in order to consistently create maximum value for our customers is our mission.
       MACOM is committed to leadership in both business and technology. As a new member of the organization, you will have the opportunity for career development as well as financial growth. We are confident that we can provide the type of dynamic environment that can most properly utilize your talents and enthusiasm.

      作为全球射频微波领域的先驱者， MACOM Technology Solutions Inc.(美国独资,美国纳斯达克上市公司)拥有超过65年丰富的设计/生产制造/器件应用经验，是全球领先的射频/微波/光模块解决方案供应商，产品主要有基于硅/砷化镓/氮化镓/铁氧体等材料的各种有源/无源器件/模块,主要用于CATV, 无线通讯, 光传输网络, 航空航天,终端,工业/医疗电子, 汽车电子等领域。2014年MACOM成功收购Nitronix Technologies，使MACOM品牌和产品不断壮大。
      MACOM拥有多个全球研发中心,分布在美国东/西岸、澳大利亚、爱尔兰、中国,同各领域的优秀领导者始终保持着紧密的合作关系。总部在美国特拉华州注册成立，在中国，我们分别在北京、上海、深圳、南京、西安设有办事处， 深圳/上海/西安建立了三个实验室，随时随地的提供端到端的服务和支持。 聚焦客户需求，提供有竞争力的解决方案和服务，持续为客户创造***价值是MACOM一贯的使命。
      MACOM公司凭借全球领先的硅基氮化镓工艺，在射频功率领域特别是5G基站，射频能量，工业医学等应用中取得了业界瞩目的进展。公司在上海建立的实验室引进了世界领先的技术和测量平台，构建全球同步的科研团队，确保大家工作在行业领先的技术领域。
     我们诚邀优秀人才加入MACOM大家庭，MACOM相信一个沟通开放、团队合作、持续学习、重视个人、家人及共同责任的工作环境是非常重要的。MACOM致力于取得业务及科技方面的领导地位，建立了并不断完善具有竞争力的薪酬福利政策，提供技术培训和个人提升的机会，身为组织中的一员，您将有事业发展和经济成长的机会。我们有自信可以提供您活力的环境，使您可以发挥您的智慧和热情！

公司地址：

镁可微波技术（上海）有限公司
上海市浦东新区纳贤路60号4号楼

镁可微波技术（上海）有限公司深圳分公司
深圳市南山区科苑路15号科兴科学园A2-15楼 518057