信号完整性工程师(J10877)
长江存储科技有限责任公司
- 公司规模:5000-10000人
- 公司性质:国企
- 公司行业:电子技术/半导体/集成电路
职位信息
- 发布日期:2020-03-18
- 工作地点:上海
- 招聘人数:若干人
- 工作经验:3-4年经验
- 学历要求:本科
- 职位月薪:15-35万/年
- 职位类别:半导体技术
职位描述
工作职责:
1.负责存储芯片及存储系统物理实现的芯片级及系统级SI/PI分析工作
2.端到端实现DDRx,PCIe,SATA,MPHY等高速接口方案,保证芯片及系统高速性能,负责对高速接口进行仿真及测试
3.端到端实现电源完整性分析,保证芯片及系统电源性能,负责电源完整性相关仿真与测试
4.负责高频高速信号测试平台的搭建,负责相关测试夹具的设计及优化
5.负责系统级SI/PI设计定义,负责设计阶段Pre-layout 和Post-layout分析,指导进行layout设计
6.负责产品EMC测试
1.Be responsible for chip level and system level SI/PI analysis in physical implementation of memory chips and storage systems, such as SSD, UFS, EMMC, NAND…
2.End-to-end implement high-speed interface scheme such as DDRx, PCIe, SATA, MPHY; guarantee high speed chip and system performance, be responsible for high speed interface analysis with simulation and testing methods
3.End-to-end implement power integrity analysis and guarantee PI performance, be responsible for chip level and system level power integrity simulation and testing
4.Be responsible for building high frequency/high-speed signal test platforms, responsible for the relevant test fixture design and optimization
5.Be responsible for system-level SI/PI specification definition; be responsible for pre-layout and post-layout analysis in design phase; guide layout design
6.Be responsible for EMC test
任职资格:
1.本科以上学历,电子电路、电磁场、微波、射频等相关专业,有3年以上信号完整性,电源完整性,硬件开发及PCB板开发设计经验,熟练使用ADS、Ansys SIwave、Designer、HFSS、Hspice等仿真工具,熟练使用Allegro、PADs等EDA工具
2.具备高速示波器、矢量网络分析仪、TDR、频谱分析仪等仪器设备测试经验
3.具备扎实的信号完整性和电源完整性仿真、测试及分析能力
4.熟悉PCB或Package工艺,材料,层叠,加工,制程等
1.Bachelor’s degree or above; electronic circuit, electromagnetic field, microwave, RF or other related professional; more than 3 years signal integrity, power integrity, hardware development and PCB design experience; proficient in use of simulation tools like ADS, Ansys SIwave, Designer, HFSS and Hspice; familiar with Allegro, PADs and other EDA tools
2.Proficient in operating high-speed oscilloscope, vector network analyzer, TDR, spectrum analyzer
3.Solid ability at signal integrity and power integrity simulation, test and analysis
4.Be familiar with PCB or Package process, material, stack up, technology, process, etc.
职能类别:半导体技术
公司介绍
联系方式
- 公司地址:东湖新技术开发区未来三路88号