Hardware Current Product Engineer(职位编号：1232974)
惠普公司
- 公司规模：10000人以上
- 公司行业：计算机服务(系统、数据服务、维修)
职位信息
- 发布日期：2014-02-19
- 工作地点：上海
- 招聘人数：若干
- 学历要求：本科
- 职位月薪：面议
- 职位类别：机电工程师
职位描述
Job description:
This is a hardware current product engineering position, under the LaserJet printing quality organization based in Hewlett-Packard Shanghai.
You will mainly focus on the electronics, the mainboard PCA part and touch screen interface boards, which is used in our LaserJet printers. You will be the first point of contact for field and customer warranty issues. Responsibilities include analyzing parts from field returns, investigating into specific causes for high failure rates, recommendation for a fix, which may result in a design change or component change. You will need to work with partners from US for regular technical discussions; therefore a strong command of English is necessary. Hands on experience is required, the engineer will have to conduct debug analysis for the failed parts for issue troubleshooting. Everyone in the team is a quality champion, monitoring warranty rates from the customer/field for products owned. You will need to work with the customer/field to understand quality and warranty issues, driving the investigation and issue resolution. In the early NPI stage, you will provide hardware performance feedbacks to the R&D team, such that quality issues seen in predecessor design can be eliminated.
You are also the EE expert, consulted and responsible for EE part changes and developing qualification plans for the changes. You would need to work with the factories/manufacturing partners in implementing changes, either directly or through an operations engineer.
Besides an EE engineer, you will also be expected to participate or lead in special warranty improvement initiatives for the emerging geographies. You would need to plan and manage special tests as needed to support continuous improvement and to further understanding of product performance.
Qualifications
Skill requirement:
• Bachelor degree and above: EE preferred. Candidates from other discipline will be considered if they have significant relevant work experience.
• 6 years+ working experience (Bachelor), 4+ years working experience (Master)
• Previous working experience on PCA/PC motherboard a must, ability to understand PCA schematics for subsequent troubleshooting is required. FPGA design or application experience desired. Experience with touch screen CGD designs/QA/manufacturing is required.
• Experience working either in an ODM/CM environment, or managing the ODM/CM is advantageous.
• Good understanding of EMC tests.
• Good command of English (CET-6).
• Excellent troubleshooting and analytical skills.
• Good Excel, Word, Powerpoint knowledge. Plotting charts and diagrams, creating powerpoint for issue updates and writing procedural documents.
This is a hardware current product engineering position, under the LaserJet printing quality organization based in Hewlett-Packard Shanghai.
You will mainly focus on the electronics, the mainboard PCA part and touch screen interface boards, which is used in our LaserJet printers. You will be the first point of contact for field and customer warranty issues. Responsibilities include analyzing parts from field returns, investigating into specific causes for high failure rates, recommendation for a fix, which may result in a design change or component change. You will need to work with partners from US for regular technical discussions; therefore a strong command of English is necessary. Hands on experience is required, the engineer will have to conduct debug analysis for the failed parts for issue troubleshooting. Everyone in the team is a quality champion, monitoring warranty rates from the customer/field for products owned. You will need to work with the customer/field to understand quality and warranty issues, driving the investigation and issue resolution. In the early NPI stage, you will provide hardware performance feedbacks to the R&D team, such that quality issues seen in predecessor design can be eliminated.
You are also the EE expert, consulted and responsible for EE part changes and developing qualification plans for the changes. You would need to work with the factories/manufacturing partners in implementing changes, either directly or through an operations engineer.
Besides an EE engineer, you will also be expected to participate or lead in special warranty improvement initiatives for the emerging geographies. You would need to plan and manage special tests as needed to support continuous improvement and to further understanding of product performance.
Qualifications
Skill requirement:
• Bachelor degree and above: EE preferred. Candidates from other discipline will be considered if they have significant relevant work experience.
• 6 years+ working experience (Bachelor), 4+ years working experience (Master)
• Previous working experience on PCA/PC motherboard a must, ability to understand PCA schematics for subsequent troubleshooting is required. FPGA design or application experience desired. Experience with touch screen CGD designs/QA/manufacturing is required.
• Experience working either in an ODM/CM environment, or managing the ODM/CM is advantageous.
• Good understanding of EMC tests.
• Good command of English (CET-6).
• Excellent troubleshooting and analytical skills.
• Good Excel, Word, Powerpoint knowledge. Plotting charts and diagrams, creating powerpoint for issue updates and writing procedural documents.
公司介绍
惠普（HP）公司成立于1939年，是一家业务运营遍及全球170多个国家和地区的高科技公司。我们致力于探索科技和服务如何帮助人们和企业解决其遇到的问题和挑战，并把握机遇、实现愿景、成就梦想。我们运用新的思想和理念来打造更简单、更有价值、更值得信赖的技术体验，不断帮助客户改善其生活和工作方式。
惠普（HP）是全球最大的信息科技（IT）公司之一。我们提供广泛的基础设施和商业产品，从手持设备到世界上最强大的超级计算机，一应俱全。我们为消费者提供了一系列广泛的产品和服务，从数码摄影到数码娱乐，从计算产品到家用打印。这一全面的产品组合让我们能够针对客户的特定需求，提供合适的产品、服务和解决方案。在截止至2007年10月31日的2007财年中，惠普（HP）的营业额达1043亿美元，在2007年美国财富500强中排名第14位。
更多详细信息，请登陆:http://www.hp.com/go/job
惠普（HP）是全球最大的信息科技（IT）公司之一。我们提供广泛的基础设施和商业产品，从手持设备到世界上最强大的超级计算机，一应俱全。我们为消费者提供了一系列广泛的产品和服务，从数码摄影到数码娱乐，从计算产品到家用打印。这一全面的产品组合让我们能够针对客户的特定需求，提供合适的产品、服务和解决方案。在截止至2007年10月31日的2007财年中，惠普（HP）的营业额达1043亿美元，在2007年美国财富500强中排名第14位。
更多详细信息，请登陆:http://www.hp.com/go/job