Process Development Engineer
飞思卡尔半导体（中国）有限公司上海分公司
- 公司行业：电子技术/半导体/集成电路
职位信息
- 发布日期：2013-09-09
- 工作地点：天津
- 招聘人数：若干
- 工作经验：在读学生
- 学历要求：本科
- 职位类别：测试工程师
职位描述
Job Description:
This position is a packaging front-end R&D engineer, and will be focusing on IC (integrated circuit) Cu wire bonding process development, work with global team to finish development projects and other tasks as listed below:
- New packaging technology development
- New package related process development
- Advanced material interface study
- Advanced IC package failure analysis
- Coordinate/lead development project independently
- Communication/cooperation among global teams (US/Germany/Malaysia/Japan/France/etc.)
- Understand requirement from internal stakeholders and external customers and create/align project scope
English will be the language for written and oral communication, strong academic/technical background will be needed in order to initiate/complete advanced R&D projects independently.
Qualification:
Studying in grade 3 with bachelor degree or grade 2 with master degree in metallography or mechanics.
CET-6 or equivalent English level.
Intention and capability to work in a cross-functional/ global team environment.
Independent R&D capability.