天津招聘

职位要求：
- Degree in Mechanical/Microsystem Engineering or equivalent

- At least with 5 years of related work experience.

- Requires 8D, SPC, DoE, computer skills,

- Requires experiences min 2 of the following fields: die bonding, wire bonding, molding, casting, trim & form

- Able to work under minimum supervision.

- Requires computer skills with common Microsoft knowledge.

- Initiative & enthusiastic, good knowledge in problem solving, sense of responsibility, high adaptability, good leadership.

- Good interpersonal and communication skill, work independently, resourceful.

- Must be able to read, write & communicate in English & Chinese.

- Requires assertiveness

职位沟通要点：
- Improvement, stabilize key processes like Wire bonding, molding, trim & form in a systematic way (i.e. DoE and SPC)

- Able to apply DOE and drive Process Improvement Program

- Review and improve process monitoring and control (effective use of SPC) to achieve sustainable process stability

- Support in yield improvement activities (systematic and sustainable yield improvement methodology - data gathering, analysis, hypothesis, validation, corrective action)

- Initiate and support cost down activities

- Coaching of a systematic problem solving procedure

- Support QA in customer complaints

- Manage PPCM (Product Process Change Management).

- Periodic meeting to review effectiveness of result

- Interface to OS process engineers

- Identify root cause, initiate & involve with line quality improvement

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