天津招聘

1. Handle all packaging issues for old and new projects.

   处理所有的包装问题，包括老的和新的项目

2. 2.  Owner of all packing process related developments, including operation, C/T, scrap

      负责所有包装工艺的开发和优化，包括操作，C/T，报废率

1. KEY RESPONSIBILITIES

1. Familiar with the commonly used packaging material properties and its processing technology；

   熟悉常用包装材料的特性和其加工工艺;

2. Design packaging specifications; ensure packaging components meet specified standards and specifications for each country；

   设计包装规格;确保包装的组成部分符合规定的标准和规格;

3. Provide packaging proposals for new projects；

   为新项目提供包装方案;

4. Update packaging BOM and technical document; release packaging document; Update the SAP data

   更新包装材料和技术文件;释放包装的文件,更改SAP数据;

5. Manage all packaging testing and labels which belong to individual project

   管理个人负责项目的所有包装测试、标签;

6. ECN implementation

   工程变更的执行

7. Handle any existing product packaging issues, and provide corrective action；

   处理任何现有的产品包装问题，并提供纠正行动;

8. Optimize and standardize packing methods and materials; Provide technical support to reduce the packing cost (material, process)

       优化和规范的包装方法和材料;提供技术支持，降低包装成本（材料，工艺）；

赫比国际有限公司成立于1980年，是涉足机电模具、通讯业、消费电子和计算机业的领先供应商。我们多元化的服务涉及工业和产品设计，制造，组装以及配套增值服务如表面处理的精加工、外包制造以及精密金属冲压。

赫比公司的总部位于新加坡，全球共拥有15处工厂和技术支持中心。现有约20,000名雇员服务于赫比公司。

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Founded in 1980,Hi-P is a leading supplier of electro-mechanical modules to the telecommunications, consumer electronics and computing industries. Our diversified service offering ranges from industrial and product design, manufacture, assembly, ancillary value –added services such as surface decoration finishing and precision metal stamping as well as turnkey contract manufacturing.

Headquartered in Singapore, Hi-p has an extensive footprint with 15 manufacturing plants globally and engineering-support centers. We currently employ about 20,000 people.

For more information, please review our website: ************