深圳招聘

职位描述：
Duties and Responsibilities:
1) Design microelectronics packaging, components and assemblies for MEMS surface mount microphones.
2) Work directly with key customers to develop design concepts, review options, and resolve technical issues.
3) Act as packaging design engineer over the entire life cycle of new product development from prototype design to full mass production launch.
4) Produce fabrication prints and manufacturing documentation for new products.
5) Handle requisitions, quotes and placement of purchase orders for R&D prototypes
6) Coordinate cross functional design reviews.
7) Work with manufacturing engineers and suppliers for design development and fabrication.
8) Work with process engineers in developing platform design rules.
9) Work with quality engineers in to ensure designs meet all quality and reliability requirements.
10) Acquire and apply new knowledge as required by dynamic product development environment.
11) Search for and evaluate new suppliers and the viability of new packaging technologies.

Job Specifications
1) BS degree in Mechanical or Materials Science Engineering, advanced degree a plus.
2) Minimum 2 years of related experience in microelectronics packaging design, development and fabrication.
3) Experience working as a direct technical interface to customers to develop design concepts and resolve issues.
4) Strong background in design for assembly and design for low cost manufacturing.
5) Familiarity with applicable electronics packaging industry standards such as IPC and JEDEC.
6) Strong understanding of mechanical engineering design principals and the ability to apply them to innovate and solve complex problems.
7) Experience in SolidWorks and/or AutoCAD or equivalent. Experience with PADS layout tool will be considered as a plus
8) Experience with PCB/IC substrate materials and fabrication processes.
9) Basic knowledge of semiconductor materials and fabrication processes.
10) Experience with package design for RF components, both passive and active.
11) Knowledge of geometric dimensioning and tolerancing, tolerance stack-up principles and understanding of real-world fabrication processes.
12) Knowledge of acoustics is a plus.
13) Ability to multi-task within a fast paced , dynamic environment
14) Team player, detail-oriented, self-motivated and able to work independently with minimal guidance
15) Software skills including MSOffice, Excel and statistical analysis are required.
16) Excellent verbal and written communication skills
17) Ability to travel internationally 2-3 times per year as required. 举报 分享

Knowles Corporation（纽交所代码：KN）创立于1946年，是全球领先的微型声学解决方案及专业元件供应商，服务领域涉及移动通讯、消费电子、医药科技、军事、航空航天和工业市场。在智能手机、平板电脑和移动通讯领域，楼氏的微机电系统麦克风、扬声器和受话器始终具有领导地位。同时Knowles也是应用于助听器和其他医疗器械的受话器及麦克风的领先供应商。此外，在电容器组件市场，也具有极高的占有率。
楼氏电子于1996年正式进入中国市场，致力于高质量的产品设计研发与生产，为客户提供创新的解决方案并发展合作共赢关系。近二十年来，楼氏紧随中国市场的发展，不断突破，成就卓越，目前在全国拥有4个分支机构，分别设在苏州、上海、北京和深圳。未来，楼氏电子将持续致力于成为完美声学以及高端电容器、数据和信号交换解决方案的创新者和领导者，引进能够成为行业标准的颠覆性技术，为客户提供更有效的解决方案。

公司因持续发展需增聘一批有才华，有能力，有责任心，有团队精神的高素质人才加盟楼氏，公司将为优秀的人才提供优厚的薪资待遇和海外培训机会。

请将简历发至keshr@knowles.com（注：请用英文标题，不要使用RAR文件）