深圳 [切换城市] 深圳招聘深圳电子/电器/半导体/仪器仪表招聘深圳嵌入式硬件开发(主板机…)招聘

Applications Engineer for CAP products

升特半导体(深圳)有限公司

  • 公司规模:150-500人
  • 公司性质:外资(欧美)
  • 公司行业:电子技术/半导体/集成电路

职位信息

  • 发布日期:2016-09-27
  • 工作地点:深圳
  • 招聘人数:1人
  • 工作经验:5-7年经验
  • 学历要求:本科
  • 语言要求:英语 熟练
  • 职位月薪:10000-14999/月
  • 职位类别:嵌入式软件开发(Linux/单片机/PLC/DSP…)  嵌入式硬件开发(主板机…)

职位描述

职位描述:
Responsibilities/Duties:
? Firmware development for C-51 and ARM-based microcontrollers using C and the Microsoft Visual Studio design environment
? Hardware design using Altium and OrCAD tools
? Bring up, debug, test and troubleshoot hardware and firmware
? Promote, demonstrate and provide total solution/reference design to customer base on company parts
? Work closely with field application engineer for resolving customer issues
? Collect customer requirement and feedback to business unit marketing
Qualifications/Experience Requirements:
? Strong C and Microsoft Visual Studio development and debugging skills
? Rich experience in capacitance sensing product design, include hardware and firmware
? Skillful in Windows and Linux driver development, familiar with I2C, SPI, USB etc interface protocol,
? Android OS driver is plus
? Excellent verbal and written communication skills and the ability to work in a team environment
? 5+ years engineering in Electrical, Computer, Software, or Mechatronics disciplines, or Computer Science

职能类别: 嵌入式软件开发(Linux/单片机/PLC/DSP…) 嵌入式硬件开发(主板机…)

关键字: CAP Software Hardware Firmware

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公司介绍

Semtech Corporation is a leading supplier of high performance analog and mixed-signal semiconductors and advanced algorithms for high-end consumer, enterprise computing, communications, and industrial end-markets. We have nearly 60 years of experience designing and manufacturing proprietary platforms differentiated by innovation, size, efficiency, performance, and reach. Our balanced portfolio of semiconductor products is used by original equipment manufacturers and their suppliers for automotive, broadcast equipment, data centers, passive optical networks (PONs), industrial, Internet of Things (IoT), LCD TVs, smartphones, tablets, wearables, and wireless infrastructure applications.

联系方式

  • 公司地址:地址:span广东深圳市南山区科技园