Package Development Sr.Mgr（半导体）
深圳市华诚鑫不锈钢有限公司
- 公司规模：1000-5000人
- 公司性质：民营公司
- 公司行业：批发/零售 专业服务(咨询、人力资源、财会)
职位信息
- 发布日期：2013-12-29
- 工作地点：深圳
- 招聘人数：1
- 语言要求：英语精通
- 职位月薪：50000及以上
- 职位类别：半导体技术
职位描述
Responsibility
1 Provide technical support on existing package for customer engagement
2 Develop new package according to market trend and need
3 Drive improvement on existing package MSL capability and BOM
4 Maintain STD BOM and update design rule according to new capability established
5 Coordinate with process development team and drive process capability to maintain market competitiveness
Qualifications
1 B.Engineering/Msc
2 Excellent communication and presentation skills (written and verbal).
3 Highly-developed interpersonal and people management/development skills.
4 In depth knowledge of IC manufacturing processes and Packaging
5 Minimum 10 years experience in Package development
1 Provide technical support on existing package for customer engagement
2 Develop new package according to market trend and need
3 Drive improvement on existing package MSL capability and BOM
4 Maintain STD BOM and update design rule according to new capability established
5 Coordinate with process development team and drive process capability to maintain market competitiveness
Qualifications
1 B.Engineering/Msc
2 Excellent communication and presentation skills (written and verbal).
3 Highly-developed interpersonal and people management/development skills.
4 In depth knowledge of IC manufacturing processes and Packaging
5 Minimum 10 years experience in Package development
公司介绍
团队介绍
联系方式
- 公司地址：上班地址：朝阳区将台路