深圳招聘

Job Description:
1. Overall yield management to cover assembly and test for specific product.
2. Commonality analysis by product design/process/machine/material/measurement, Coordinate different teams to dig out the root cause and come out effective improvement plan.
3. Conduct engineering DOEs and apply statistical analysis method to solve problems, make decision with data.
4. Assembly process set up and continuously improvement: Flip-Chip Assembly (Flip-Chip Attach, Underfill, SMT, etc.)
5. Production line excursion/abnormal case disposition.
6. Engineering value (cost reduction) project follow up and implement.
7. Production capacity/productivity continuously improvement.

Qualifications:
REQUIRED:
1. Bachelor or above, major in Automation, Mechatronics, Materials Science and Technology, electrical and electronics, etc.
2. 3~5 years’ process experience in semiconductor packaging and assembly field(Flip-Chip Assembly Process).
3. Good communication skill and team work spirit, willing to work under certain pressure.

PREFERRED:
1. Strong Knowledge in semiconductor packaging and assembly field, esp. Flip-Chip Assembly Process.
2. Good at AutoCAD, 3D drawing, Animations, Solidworks, JMP (Or other equivalent statistic software, Spot-fire) etc.
3. Familiar with one of programming language will be a plus.

SKILLS:
1. Good communication skill at both Chinese and English.

Western Digital？（西部数据公司）推动数据繁荣，缔造辉煌成就。从手机、云端到各个站点——凡是数据所及之处，我们致力于以创新促成今日繁荣，为明日辉煌保驾护航。一切新的设备、系统、解决方案以及世界领先的数据基础架构，均经过专门的优化和调整，为***化发挥数据潜力打好根基。今天，西部数据公司的产品组合和技术方案正在帮助着全世界用户获取、保存、访问和转换日益多样化的数据。作为数据中心基础架构领域的领导者，为数据工作人员及系统赋能，我们义不容辞。
西部数据公司以数据为中心的解决方案由Western Digital？（西部数据）、SanDisk？ （闪迪）、WD？（西数）、WD_BLACK？和G-Technology？品牌组成。