深圳招聘

Job Description:
- Responsible for IC package design mainly focus on Leadframe packages (leaded, non-leaded) and substrate packages (as secondary) in accordance with industry standards and customers’ specifications

- Work with business line, assembly team, supplier and subcon for spec review and provide technical consultation on package design related issues as needed
- Utilize package / die co-design tool for design for performance and manufacturability
- Work closely with team members to ensure that the design rules and standard notes are updated consistent with the existing process manufacturability

Qualification:
- Bachelor’s Degree or above in Mechanical and Electrical Engineering, or equivalent years of experience is acceptable

- Professional package design experience on leadframe, 8 years is a minimum

- Knowledgeable of IC Package leadframe and substrate fabrication and assembly

- Experience with design of wirebond BGA and FlipChip BGA substrates is desirable

- Professional on AutoCAD, experience with Cadence SIP or PCB Layout experience using Cadence Allegro will be a plus

- Geometric Dimensioning and Tolerancing proficiency is required

- Good English written and oral communication skill, CET-6 or equivalent English level required

- Service orientated and able to work well with people at all levels independently

- Be able to lead/drive technical project professionally

- Strong sense of ownership and responsibility

- Good self-discipline & teamwork

NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has over 29,000 employees in more than 30 countries and posted revenue of $8.88 billion in 2019.