深圳招聘

  

DUTIES & RESPONSIBILITIES:

  

The responsibility of the AE is to design and test hardware/module solutions to enable demonstration of Gennum Burst Mode Integrated Transceiver products for a number of target Multi-Gigabit applications. In addition, the AE will be required to provide outstanding customer support including proactive and reactive responses to customer inquiries.

  

Specific duties include:

  

• Design hardware to support operation of complex Integrated Transceiver products using a variety of tools to facilitate high speed data transmission at data rates in excess of 10Gbps.
• Use a variety of tools to capture Schematic intent, design high speed PCB’s with the ability to consider and simulate the associated signal integrity issues.
• Design Application kits to encompass Module/Host Board sampling to customers.
• Contributing towards achieving “design-in” status for our Multi-Gigabit Burst Mode Transceiver products.
• Provide Direct Customer Support and associated technical solutions, in close association with the Sales team.
• Perform fault finding, debugging and resolution of internal and customer issues.
• Produce, contribute and help maintain project documentation such as Application Notes and Application Kits. Show a commitment to quality in the full development cycle of Design, Development and Documentation.
• Proactively working with other groups including Product Marketing/Sales & Design Engineering to resolve customer concerns and also during the product development cycle.
• Attend Design Reviews and cover Applications based questions that may occur.
• Develop detailed knowledge of the products that they are responsible for supporting, by reading the supporting literature and from lab based testing.

  

EXPERIENCE AND QUALIFICATIONS:

  

• BS degree in Electronic Engineering or Computer Engineering/Science
• Minimum of 5 years’ experience in a similar customer support role in the microelectronics (IC) or Wireless/Optical communications industry.

  

• Good knowledge of Analogue and Digital/MCU circuit design.

• Understanding and experience of high speed printed circuit board(PCB) design, coupled with the ability to use PCB design tools to deliver complete hardware solutions.

• Experience of Signal Integrity issues associated with high speed data transfer and the ability to design solutions that overcome these issues.

• Use of planar and or 3D field solvers would be desirable.

• Experience of using measurement equipment to perform key parametric measurements using equipment such as Communication Analysers, Bit Error Rate Testers, Optical Laser Sources/Attenuators, High Speed real time scopes, etc, etc.

• Knowledge SFF-8472 Specification for Diagnostic Monitoring Interface for Optical Transceivers would be desirable but not a necessity.

            

• Experience programming 8bit (8051 core) and 32 bit(ARM core) microcontrollers using Keil/IAR tools with consideration for code space, RAM usage and execution time is preferred
• Experience in debugging and testing embedded software in C is preferred
• The candidate should have initiative, technical aptitude and creativity, is results oriented and can flexibly manage time, priorities and multiple projects
• Have good command of the English language in speaking, reading and writing

  

• Excellent organizational, networking, interpersonal and communication skills

• Have the ability to work well within a team environment as well as a independent contributor

    

Semtech Corporation is a leading supplier of high performance analog and mixed-signal semiconductors and advanced algorithms for high-end consumer, enterprise computing, communications, and industrial end-markets. We have nearly 60 years of experience designing and manufacturing proprietary platforms differentiated by innovation, size, efficiency, performance, and reach. Our balanced portfolio of semiconductor products is used by original equipment manufacturers and their suppliers for automotive, broadcast equipment, data centers, passive optical networks (PONs), industrial, Internet of Things (IoT), LCD TVs, smartphones, tablets, wearables, and wireless infrastructure applications.