深圳招聘

工作职责:

主要内容：组织堆叠策划和基带评估、堆叠板型成本与技术可行性评估、平台及芯片总结分析、研究各尺寸最优；

堆叠、竞品拆机分析、月度主流机型分析报告 ；

目的：开发具有成本优势的智能机平台、堆叠板型、堆叠、功能；创造成本最优堆叠和整机。

1.组织堆叠策划和基带评估；

2.平台及芯片总结分析（高通、展讯、MTK 等）；

3.月度主流机型分析报告（ID、堆叠、尺寸、功能、配置）；

4.堆叠板型成本与技术可行性评估；

5.研究各尺寸最优堆叠（综合成本优势、ID 效果、结构可靠性、可生产性）；

6.竞品拆机分析；

7.新技术的研究建议（新平台、硬件新功能、软件新功能）。

任职资格:

1、大学本科及以上学历，5年以上手机行业基带或LAYOUT等工作经验 。

2、熟悉智能机平台和芯片/BB硬件/Layout/ RF射频等知识； 对音频设计及调试/中试 等有一定了

解；了解 智能机产品定义/测试相关知识；

3、熟悉memory基本原理及相关设计，熟悉高速信号设计相关知识 ；熟悉LCD, CAMERA等基

本原理及相关设计 ；熟练使用原理图及PCB设计工具，熟练使用各种调试工具，示波器等 ；

4、对电源相关知识有一定理解，熟悉智能机电源设计规范，了解电源仿真相关概念 ；

5、有完整项目经验，包括原理图设计，PCB布局，LAYOUT检查，BOM整理，整机调试，量产

维护，产线支持等 ；

6、熟悉手机常用相关元器件，包括电声器件，模拟数字器件等，有过器件认证经验 ；

7、性格活泼开朗，积极乐观，具备较强的计划和执行能力，良好的协调和人际沟通能力 。

工作地点：深圳/上海

公司主营通讯和半导体两大业务板块，目前已经形成从芯片设计、晶圆制造、半导体封装测试到产业物联网、通讯终端、笔记本电脑、IoT、汽车电子产品研发制造于一体的庞大产业布局。
通讯业务板块
包括手机、平板、笔电、IoT、汽车电子等领域，服务的客户均为全球主流品牌，已经与90%以上的主流品牌建立合作关系并不断深化。研发中心分布在上海、无锡、深圳、西安，制造基地分布在嘉兴、无锡、印度和印尼，另外在美国、韩国、日本设立了创新中心。
国际数据公司IDC、美国市场调研机构IHS和中国赛诺市场研究公司的研究数据均显示，闻泰连续多年出货量在全球手机ODM（原始设计制造）行业中处于龙头地位。
半导体业务板块
闻泰科技旗下的安世半导体是全球知名的半导体IDM公司，是原飞利浦半导体标准产品事业部，有60多年半导体研发和制造经验，总部位于荷兰奈梅亨，晶圆制造工厂在德国汉堡和英国曼彻斯特，封装测试工厂位于中国东莞、菲律宾卡布尧和马拉西亚芙蓉。客户超过2.5万个，产品种类超过1.5万种，每年新增700多种新产品，全部为车规级产品。安世半导体年产能超过1000亿颗，在与欧美半导体巨头的竞争中，安世在各个细分领域均处于全球领先。

Wingtech Technology
-- The world's leading company in communications and semiconductor.

Wingtech’s main business includes communication terminal and semiconductor business. We have formed a huge industry layout from chip design, wafer manufacturing, semiconductor packaging test to IIoT, communication terminals, laptop, IoT, auto electronic products R&D manufacturing.

Communications Business:
The communication terminal business include mobile phones, tablets, laptops, IoT and other fields. The customers we served are all global top brands, and we have established cooperative relationship with more than 90% of the mainstream brands and kept deepening it. R&D centers are located in Shanghai, Wuxi, Shenzhen, and Xi 'an, manufacturing bases are located in Jiaxing, Wuxi, India and Indonesia, and innovation centers are located in the United States, South Korea and Japan.
Research data from international data company IDC, American market research institute IHS and China's Sano market research which all showed that Wingtech Technology's shipments have been in the leading position in the global mobile phone ODM (original design and manufacturing) industry for continuous years.

Semiconductor Business:
Nexperia is the world-renowned semiconductor IDM company, which belongs to Wingtech Technology. Nexperia was the original Royal Philips semiconductor standard products division. They have more than 60 years of semiconductor R&D and manufacturing experience, headquartered in Nijmegen, Netherlands, wafer manufacturing located in Hamburg, Germany and the UK Manchester, assembly factory in Dongguan, China, Cabuyao, Philippines and Seremban, Malaysia. They have more than 25,000 customers and more than 15,000 types of products. More than 700 new products are added for every year, all of them are vehicle regulation level products.
Nexperia annual production capacity is more than 100 billion units. During the competition with various European and American semiconductor giant, Nexperia is the world leader in each segment.