Leadframe Engineer/Designer
意法半导体制造（深圳）有限公司
- 公司规模：500-1000人
- 公司性质：外资(欧美)
- 公司行业：电子技术/半导体/集成电路
职位信息
- 发布日期：2013-01-15
- 工作地点：深圳-龙岗区
- 招聘人数：1
- 工作经验：五年以上
- 学历要求：本科
- 职位类别：工艺工程师 半导体技术
职位描述
Practical Responsibilities
- Responsible in designing preliminary and final leadframe drawings and ensuring all documents for leadframe reviewed, updated and properly documented.
- Work with process engineering/QA etc team for the qualification of new leadframe designs.
- Provide technical advice to purchasing during vendor negotiation
- Collaborate with divisions and leadframe supplier for leadframe technology & roadmap
Requirements:
- Be an Engineering degree holder; Master's degree is an advantage
- Have a minimum of 5 years experience in Semiconductor Assembly and packaging gained from functions of Process Engineering, Quality Assurance, Equipment Engineering and or Package Development.
- Good knowledge and working experience in mechanical drawing, dimensioning & tolerance, familiar with AutoCAD etc software.
- Knowledge in procedure to create/modify leadframe specification, use of DOE, SPC, FMEA etc tools.
- Knowledge of leadframe-based and related assembly technology, leadframe manufacturing and plating technology.
- Experience in Computer Aided Engineering and Finite Element Analysis is an advantage.
- Dynamic, initiative, resourceful with good interpersonal and communication skill with people at all levels.
- Responsible in designing preliminary and final leadframe drawings and ensuring all documents for leadframe reviewed, updated and properly documented.
- Work with process engineering/QA etc team for the qualification of new leadframe designs.
- Provide technical advice to purchasing during vendor negotiation
- Collaborate with divisions and leadframe supplier for leadframe technology & roadmap
Requirements:
- Be an Engineering degree holder; Master's degree is an advantage
- Have a minimum of 5 years experience in Semiconductor Assembly and packaging gained from functions of Process Engineering, Quality Assurance, Equipment Engineering and or Package Development.
- Good knowledge and working experience in mechanical drawing, dimensioning & tolerance, familiar with AutoCAD etc software.
- Knowledge in procedure to create/modify leadframe specification, use of DOE, SPC, FMEA etc tools.
- Knowledge of leadframe-based and related assembly technology, leadframe manufacturing and plating technology.
- Experience in Computer Aided Engineering and Finite Element Analysis is an advantage.
- Dynamic, initiative, resourceful with good interpersonal and communication skill with people at all levels.
公司介绍
意法半导体制造（深圳）有限公司于2005年9月在深圳市注册成立，是世界半导体行业排名第五，欧洲排名第一的大型跨国公司：意法半导体有限公司(STMicroelectronics)在深圳龙岗区设立的全资子公司。公司的成立是为在深圳市龙岗区宝龙工业区开发建设集成电路封装测试项目。本项目计划分期实施，目前一期工程已投入使用，投资额将近1.9亿美元，计划5年内达到7000人以上的人力规模，项目完成后累计投资将达到5亿美元，实现产能70亿只/年。
ST Microelectronics (Shenzhen) Manufacturing Co., Ltd was established on Sep 2005 and is wholly invested by ST Microelectronics, which is a large multinational company ranking No.5 in the world and No.1 in Europe in semiconductor industry. The foundation of the company is to contribute in the semiconductor assembly and testing project in Bao’long industrial area in Shenzhen Longgang. The project will be implemented in several phases. The first phase has been brought into operation already and the total investment is nearly 190 million US dollars so far. We forecast the total headcount will be over 7000 person in 5 years and the total investment will reach 500 million US dollars with capacity of over 7 billion units per year when the project is complete.
ST Microelectronics (Shenzhen) Manufacturing Co., Ltd was established on Sep 2005 and is wholly invested by ST Microelectronics, which is a large multinational company ranking No.5 in the world and No.1 in Europe in semiconductor industry. The foundation of the company is to contribute in the semiconductor assembly and testing project in Bao’long industrial area in Shenzhen Longgang. The project will be implemented in several phases. The first phase has been brought into operation already and the total investment is nearly 190 million US dollars so far. We forecast the total headcount will be over 7000 person in 5 years and the total investment will reach 500 million US dollars with capacity of over 7 billion units per year when the project is complete.