封装开发工程师
西部数据
- 公司规模:1000-5000人
- 公司性质:外资(欧美)
- 公司行业:电子技术/半导体/集成电路
职位信息
- 发布日期:2019-09-19
- 工作地点:上海
- 招聘人数:1人
- 工作经验:无工作经验
- 学历要求:硕士
- 职位月薪:15-20万/年
- 职位类别:其他
职位描述
Job Description:
Die Preparation (DP) process evaluation for ASIC wafer, flip chip wafer and 3D NAND wafer assembly.
New DP process recipe development to achieve high quality product and cost down.
New DP technology evaluation and introduction.
Co-work with material team with new package related material evaluation.
Co-work with objective owner to handle new product DP process.
Requirements:
Master degree in microelectronic science and technology or in material science and technology.
English communication skills: CET-6, be fluent both in oral and written English.
Basic understanding of assembly process flow & materials property.
Basic knowledge of operation principle for plasma technology.
Basic Computer & Microsoft Office skills are required, AutoCAD/Cadence/JMP are preferred.
Be capable of analyzing SEM/FIB/TEM/EDX results, operating is preferred.
Good communication/team work/planning skills.
Be capable of occasionally over time work and oversea business travel.
职能类别:其他
公司介绍
西部数据公司以数据为中心的解决方案由Western Digital?(西部数据)、SanDisk? (闪迪)、WD?(西数)、WD_BLACK?和G-Technology?品牌组成。
联系方式
- Email:compliance@wdc.com
- 公司地址:上海市闵行区江川东路388号 (邮编:200241)
- 电话:15221167566