深圳招聘

1. Plan and develop new opportunities with AOS US Assembly RD， China MKT & TW PIC department。

2. Drive the reliable feasibility evaluation of new product, design with best performance/cost ratio, robust process development and qualification with solid data for new product.

3. Plan the budget for package R&D and Assembly process engineering improvement/study.

4. Organize the key performance index and goal for assembly engineering team.

5. Drive the new qualification sample preparation, and the new process, new technology, materials, equipment study & implement for assembly line and wafer plating line.

6. Build-up the linkages and working relationships with internal technology partners to share and leverage knowledge and processes.

7. Drive the Assembly subcontract business engineering issues, qualify the new subcontract, work with subcontract to qualify and release the new parts to support the business plan, .

8. Plan and organize the training course for assembly engineering team members, and coach assembly engineering managers to drive the engineering and production line capability enhancement, -- CIP, DOE, QCC, PFMEA/DFMEA review, 8D/Engineering case study reporting skill, regular review meeting.

9. Drive the trouble shooting, yield improvement, efficiency improvement, UPH improvement, cost-down project,  QC criteria review and modify, Working instruction create & review, optimize the production flow, modify the equipments & tooling design.

10. Drive the new material, equipment and tools vendors’ certification and quality control.

任职要求：

a) Education 教育:

At least First level university degree, Advanced degree preferred, major in Physical Chemistry, Mechanical structure/design, Material Science Master degree is preferred.

b) Experience经验:

1. + years experience in semiconductor assembly R&D project/Process engineering team management or in like roles/businesses.

c) Competency and Skills能力和技能:

1.   Experience with Assembly FOL or EOL package assembly Process is necessary;

2.   Excellent knowledge on material analysis, package assembly process, package assembly equipment, package qualification method, project management

3.   Demonstrates an in-depth knowledge of key AOS operational policies, processes and methodologies applicable  to project management.

4.   Strong Communication skill, team work spirit and leadership

5.   Decision-making

6.   Quality Focus

7.   Proficient in spoken and written English

Alpha & Omega Semiconductor Co., Ltd.(简称AOS)成立于2000年9月，纳斯达克IPO 2010.4(AOSL)，总部位于美国加利福尼亚州的硅谷，是全球一家集半导体设计、晶圆制造、封装测试为一体的从事功率半导体的研发和生产的高新技术企业。2021年全球总员工人数达4000余人，主要产品包括完整的Power MOSFET、IGBT、IPM、TVS、HVIC、SiC/GaN、Power IC以及数字电源产品系列，应用于多家500强企业（如苹果、索尼、戴尔、三星、联想等）。AOS拥有全球1777项专利以及199项待批专利，业界独特功率MOSFET技术，能够不断地引入创新产品，扩大市场占有率（2020年AOS MOSFET市场占有率排名全球第六位，亚太区第四位）以及行业内快速成长，以满足先进电子产品日益复杂的功率要求。

目前AOS在全球设立了研发、生产及经营网络，包括美国、中国台湾、韩国研发中心，位于美国俄勒冈州的8寸晶圆厂，上海松江封装及测试厂以及与重庆政府合作的功率器件12寸晶圆及封测厂。在CEO张复兴先生的带领下，AOS 已经进入高速发展的阶段，并成为功率半导体市场的主力军。随着公司业务的不断发展，诚邀您加入AOS，实现共同的理想。AOS致力于提供宽松舒适的工作环境、有竞争力的薪酬以及完善的员工晋升机制，欢迎有志于在半导体行业发展的学子加盟，共创美好未来！

上班时间：8：00-16：30，有班车接送。
公司福利：五险一金、十三薪、年终奖金、带薪年假、免费工作餐、上海市班车、商业保险、生日礼金、节日礼金或礼品、员工聚餐、定期体检、员工子女福利卡、咖啡。

晋升渠道：公司每年会有调薪、一年2次绩效考核，考核优秀的员工都有机会升职加薪。
工作氛围：美资企业注重工作效率、不提倡加班、良好的工作氛围和轻松的沟通环境。

半导体行业是高新技术行业，这个行业见证了科学技术员的发展，如果你想进入这个科技日新月异的行业，如果你想接触前沿的技术水平，请加入我们，我们会给你提供一个让你施展才华的平台！