高级软件工程师,CAD
苏州芯禾电子科技有限公司
- 公司规模：50-150人
- 公司性质：民营公司
- 公司行业：计算机软件
职位信息
- 发布日期：2019-10-13
- 工作地点：上海-浦东新区
- 招聘人数：1人
- 工作经验：无工作经验
- 学历要求：招1人
- 语言要求：不限
- 职位月薪：20-30万/年
- 职位类别：高级软件工程师
职位描述
Position Description
1. The candidate will be a member of the HERMES team in Shanghai/Suzhou, to work on the development and maintenance of HERMES projects.
2. Responsible for developing CAD and mesh model for Xpeedic’s EDA products, mainly in the areas of GUI using QT and in CAD using Spatial’s Hoops and ACIS libraries.
Position Requirements
1. Bachelor’s degree in Computer Science, software engineering or related field.
2. Have at least two years of commercial software developing experience.
3. Skilled in C++ and OpenGL programming, familiar with development under Window and Linux environment.
4. Be familiar with Computer Graphics, and fully understand 3D graphic and computational geometry.
5. EDA software developing experience is a plus, especially SI/PI and EMC simulation in PCB, package and IC design.
6. Good problem solving skill and team work spirit.
1. The candidate will be a member of the HERMES team in Shanghai/Suzhou, to work on the development and maintenance of HERMES projects.
2. Responsible for developing CAD and mesh model for Xpeedic’s EDA products, mainly in the areas of GUI using QT and in CAD using Spatial’s Hoops and ACIS libraries.
Position Requirements
1. Bachelor’s degree in Computer Science, software engineering or related field.
2. Have at least two years of commercial software developing experience.
3. Skilled in C++ and OpenGL programming, familiar with development under Window and Linux environment.
4. Be familiar with Computer Graphics, and fully understand 3D graphic and computational geometry.
5. EDA software developing experience is a plus, especially SI/PI and EMC simulation in PCB, package and IC design.
6. Good problem solving skill and team work spirit.
职能类别：高级软件工程师
公司介绍
芯禾科技由业界专家创立于2010年，专注电子设计自动化EDA软件、集成无源器件IPD和系统级封装SiP微系统的研发。公司致力于为半导体芯片设计公司和系统厂商提供差异化的软件产品和芯片小型化解决方案，包括高速数字设计、IC封装设计和射频模拟混合信号设计等。这些产品和方案可以应用到智能手机、平板电脑和可穿戴等移动设备上，也可以应用到高速数据通信设备上。
联系方式
- 公司地址：地址：span科技创业园