深圳招聘

Position Description

1. Responsible for signal integrity and power integrity simulation, e.g. IC, Package, and PCB board.

2. Define PCB material and design PCB stack-up, create Signal Integrity pre-layout and post-layout, and 3D/2D passive channel modeling.

3. Trouble shooting and solution proposal for problems found from customers within very tight schedule.

4. Perform SI/PI measurement to verify the design to ensure quality and performance.

Position Requirements

1. Bachelor with 4 years related experience or Master with 2 years in SI/PI simulation/design or related fields.

2. Familiar with IEEE802.3, Ethernet, KR, SAS, SATA, PCIE, SPI, HDMI, USB, and DDR3 interfaces.

3. Familiar with IBIS, AMI, HSPICE and other simulation models.

4. Skilled use of simulation tools such as Hspice, HFSS, ADS, OptimizePI, Sigrity, SIwave, Q3D, etc.

5. Understand signal integrity parameters and evaluate trade-offs between design parameters to determine an optimum solution specification range. Understanding of one of the typical theory of Signal Integrity, High-speed digital design or High-speed interconnect is a must.

6. Familiar with measurement tools such as Digital scope, TDR, VNA or BERT is preferred.

7. Understanding of theory based of Power Integrity or PDN analysis is preferred.

8. Proven result driven performances and able to work independently under pressure.

9. Good written English and oral English is a strong plus.

芯禾科技由业界专家创立于2010年，专注电子设计自动化EDA软件、集成无源器件IPD和系统级封装SiP微系统的研发。公司致力于为半导体芯片设计公司和系统厂商提供差异化的软件产品和芯片小型化解决方案，包括高速数字设计、IC封装设计和射频模拟混合信号设计等。这些产品和方案可以应用到智能手机、平板电脑和可穿戴等移动设备上，也可以应用到高速数据通信设备上。