深圳招聘

Essential Duties and Responsibilities

1. Responsible for process ownership of the Die Attach (eutectic and epoxy DA) and Wire Bonding Process in the assembly line.

2. Develop the Die Attach/Wire bonding process for the new product.

3. Establish statistical process control (SPC) monitoring in Die Attach / Wire Bonding operation.

4. Improve yield & UPH of the assigned processes, including cost reduction activities.

5. Troubleshooting and problem solving in the assembly line using FMEA and statistical engineering tools related.

6. Performing DOE as necessary to make continuous improvements.

Qualifications and Requirements

1. Masters/Bachelor's Degree in Electrical/Electronics/Materials/Mechanical Engineering or related.

2. Good knowledge on failure analysis of die attach/wire bonding.

3. Solid DOE, FMEA and SPC experience.

4. Minimum 5 years of working experience in die attach process in MNC manufacturing environment.

5. Very good communication skills and ability to work effectively in a cross functional environment with people at all levels and multiple sites.

6. Good in spoken and written Chinese and English.

7. Good optical knowledge is preferred

8. Experience in using Palomar, H&K and ESEC machines is preferred.

                     Oclaro Technology (Shenzhen) Co., Ltd Job Description

Lumentum (NASDAQ: LITE) is a market-leading manufacturer of innovative optical and photonic products enabling optical networking and commercial laser customers worldwide. Lumentum’s optical components and subsystems are part of virtually every type of telecom, enterprise, and data center network. Lumentum’s commercial lasers enable advanced manufacturing techniques and diverse applications including next-generation 3D sensing capabilities. Lumentum is headquartered in Milpitas, California with R&D, manufacturing, and sales offices worldwide. Oclaro Technology (Shenzhen) Ltd is Lumentum’s owned subsidiary which location in Shenzhen China. For more information, visit www.lumentum.coms.