深圳招聘

KEY RESPONSIBILITIES:
1. Transmission NPI Die attach/wire bonding/seam sealing/soldering Process Development
2. Involve in the phases of concept, prototype, development and manufacturing of the products.
3. Be the prime of manufacturing process development for NPI products.
4. Support product design review, feasibility study, prototyping, product verification/qualification and small volume build in NPI phase.
5. Do DFx to support product manufacturability in terms of cost, quality, efficiency etc.
REQUIREMENTS:
1. Master/Degree in engineering, typically 3-5 years' experiences in die attach or wire bond process
2. Strong knowledge and experience on auto die bond wire bond equipment hardware and software
3. Familiar with equipment repair and maintenance as well as process control
4. Task oriented and self-driven to accomplish, good team player with good oral and written English, demonstrated good leadership skill
5. Fiber optics knowledge and background will be added advantages

                     Oclaro Technology (Shenzhen) Co., Ltd Job Description

Lumentum (NASDAQ: LITE) is a market-leading manufacturer of innovative optical and photonic products enabling optical networking and commercial laser customers worldwide. Lumentum’s optical components and subsystems are part of virtually every type of telecom, enterprise, and data center network. Lumentum’s commercial lasers enable advanced manufacturing techniques and diverse applications including next-generation 3D sensing capabilities. Lumentum is headquartered in Milpitas, California with R&D, manufacturing, and sales offices worldwide. Oclaro Technology (Shenzhen) Ltd is Lumentum’s owned subsidiary which location in Shenzhen China. For more information, visit www.lumentum.coms.