深圳招聘

职位描述：

Job Description of Design and Process Integration Engineer (SASP BU)

ü Maintain a sound knowledge and understanding of discrete semiconductor device technologies in the market place (especially for diodes, rectifiers and transistors) and transfer that knowledge to others (internal or external wafer fabrication sites)

ü Act as the principle interface with wafer fabrication sites, Marketing and product engineers to ensure effective process design and implementation

ü Develop and maintain Process technology Roadmaps for diodes and rectifiers

ü Interface with Foundries to identify process nodes which meet BU’s product requirements

ü Review and evaluate Foundry process technologies for accuracy, design ability and production readiness.

ü Evaluate and benchmark new process technologies and introduce them to support internal product roadmap, when necessary. Initiate, evaluate and execute strategic process technology activities with internal and external wafer fabrication sites

ü Develop/transfer diode and rectifier device and process technologies

ü Definition, development, and layout of test structures and design of experiments to evaluate and verify devices, processes, models and reliability

ü Monitor yield statistics and be accountable for taking appropriate remedial action on yield and product manufacturing issues

ü Other responsibilities as deemed necessary by the BU or BG Managers

Requirements

ü 5+ yrs. experience in the Semiconductor industry as a process and/or device engineer

ü Expertise in semiconductor devices including layout, device development, process development, device characterization, Simulation and wafer level reliability

ü In-depth knowledge and familiarity with process technologies needed for diodes and rectifiers

ü Expertise and experience in device physics

ü Familiarity and expertise in various major pieces of wafer fabrication equipment including photolithography, etching, implant, backgrind/backmetal deposition, epitaxial growth, chip probing

ü Familiar with wafer fabrication process flows and the various raw materials involved in the wafer fabrication process including gases, liquids, metals, dopant sources, substrate materials, solid targets

ü Able to handle projects and strategic activities independently and execute them successfully

ü Good written and verbal communication skills.

ü Well-developed interpersonal and influencing skills within and outside field of expertise

ü Ability to coach and mentor junior engineers

ü Willing to travel 35%+ of the time, including protracted trips overseas

ü Proficient in Microsoft Office

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DIODES INCORPORTD



WHO IS DIODES INCORPORATED?

 自1966年成为上市公司( Nasdaq: DIOD )

 总部和北美运输/货存中心坐落在美国加州的Westlake Village市

 约有大致有1300名员工(北美+亚洲).

 2003年销售额：一亿一千五百八十万美元

 拥有ISO-9000和 QS-9000认证的中国大陆和中国台湾工厂生产高质量低价格具竞争力的产品.

 Diodes-中国：独有的尖端制造技术,生产高可靠性高密度的表面贴装装置(SMD)，包括有SOT-23, SOD-123, SOD-323, SOT-323, SOT-363及更多

 厂商代表以及主要分销商组成的广阔网络进一步加强了产品的销售

 经营的产品包括小信号晶体管和MOS场效应管, 瞬态电压抑制二极管(TVSs), 齐纳, 肖特基, 二极管, 整流器和桥式,包装成轴式和表面贴装

 以顾客为中心的半导体分立元件制造生产商
美商DIODES Incorporated（上海凯虹电子有限公司）为美国纳斯达克(NASDAQ)上市公司，专业从事半导体电子零件（二、三极管, Analog IC）之研发、生产、销售。是全球半导体器件领域的先导企业。我们在欧美、亚太均有分支机构。目前除上海、深圳办事处外，亦有YOSUN、UPPERTECH、ZENITRON 等代理商扩展中国市场。现为扩大业务，需求下列人才。



欢迎您浏览我们的网站 www.diodes.com ; 我们热诚期待您加入DIODES的工作行列.

上海地址：上海市普陀区中山北路3000号长城大厦3001-02

深圳地址：深圳市南山区高新南四道8号创维半导体设计大厦东座16层