PCB Layout Expert Engineer
百默科技(深圳)有限公司
- 公司规模:少于50人
- 公司性质:民营公司
- 公司行业:电子技术/半导体/集成电路
职位信息
- 发布日期:2016-12-13
- 工作地点:深圳
- 招聘人数:1人
- 学历要求:本科
- 职位月薪:250000-350000/年
- 职位类别:版图设计工程师 高级硬件工程师
职位描述
职位描述:
Responsibilities:
-Perform printed circuit layouts for Automotive, consumer application and high minituarized applications ( eg. in ear headphones )
-Perform Simulation in SI, PI and EMC of PCB design
-Design multi-layer printed circuit board layouts and also Flex Printed Circuits incorporating the latest fabrication and assembly standards and considering EMC, SI and PI rules
-Align layerstack of PCB with HW Designer
-Perform embedded antenna layouts on PCBs ( eg. BT , WLAN )
-Collaborate with mechanical, design, fabrication, manufacturing and test engineers for a functional, cost effective layout.
-Participate and provide input during design reviews at key points during the layout process.
-Develop, check and release full documentation packages as required per work instructions and project requirements.
-Perform Hand over and training activities to Product Development team
-Global cooperation with all other LSA CoC departments, Product Development division as Quality, Manufacturing, Purchasing during the development process
-Realization and / or Assisting in the realization of white papers for new technologies.
-Part time performing PCB technology roadmap scouting. Focus next generation & new technologies. [ base material, layerstacks, vias, surfaces, FPC, .. ]
-Development method according and within an agile process environment
Requirements:
-Bachelor degree in engineering (Electrical Engineering, Telecommunications or appropriate graduation)
-7+ years of experience in PCB and FPC Layout design
-High experience in simulation for signal integrity, power integrity and EMC
-Common base experience in the development of analogue and digital circuits is mandatory
-High experience in working with ECAD design tools for schematic/layout realization and simulation (e.g. Mentor Graphics, SPICE, …) as well as Microsoft applications.
-Experience in Mentor DxDesigner, Expedition PCB and Hyperlynx (SI, PI, EMC Simulation)
-High knowledge of the requirements inside the automotive area, especially for EMC conform layout design
-Structured and goal- and result-orientated working style
-Ability of team work
-Good knowledge in spoken and written English
-Ability to work under pressure
举报
分享
Responsibilities:
-Perform printed circuit layouts for Automotive, consumer application and high minituarized applications ( eg. in ear headphones )
-Perform Simulation in SI, PI and EMC of PCB design
-Design multi-layer printed circuit board layouts and also Flex Printed Circuits incorporating the latest fabrication and assembly standards and considering EMC, SI and PI rules
-Align layerstack of PCB with HW Designer
-Perform embedded antenna layouts on PCBs ( eg. BT , WLAN )
-Collaborate with mechanical, design, fabrication, manufacturing and test engineers for a functional, cost effective layout.
-Participate and provide input during design reviews at key points during the layout process.
-Develop, check and release full documentation packages as required per work instructions and project requirements.
-Perform Hand over and training activities to Product Development team
-Global cooperation with all other LSA CoC departments, Product Development division as Quality, Manufacturing, Purchasing during the development process
-Realization and / or Assisting in the realization of white papers for new technologies.
-Part time performing PCB technology roadmap scouting. Focus next generation & new technologies. [ base material, layerstacks, vias, surfaces, FPC, .. ]
-Development method according and within an agile process environment
Requirements:
-Bachelor degree in engineering (Electrical Engineering, Telecommunications or appropriate graduation)
-7+ years of experience in PCB and FPC Layout design
-High experience in simulation for signal integrity, power integrity and EMC
-Common base experience in the development of analogue and digital circuits is mandatory
-High experience in working with ECAD design tools for schematic/layout realization and simulation (e.g. Mentor Graphics, SPICE, …) as well as Microsoft applications.
-Experience in Mentor DxDesigner, Expedition PCB and Hyperlynx (SI, PI, EMC Simulation)
-High knowledge of the requirements inside the automotive area, especially for EMC conform layout design
-Structured and goal- and result-orientated working style
-Ability of team work
-Good knowledge in spoken and written English
-Ability to work under pressure
职能类别: 版图设计工程师 高级硬件工程师
公司介绍
Let's shape the success!
联系方式
- Email:hr@thewayes.com.cn
- 公司地址:地址:span.