深圳招聘

职位描述：

JOB SUMMARY:

Responsible for new product development, characterization, qualification and release to production. Interfaces with semiconductor wafer fabs and package manufacturing to develop new products and bring qualified new products on time to market.

ESSENTIAL DUTIES:

• Coordinate and support new product / new technology development activities such as completing new product business analyses (NPBA), reviewing & analyzing new product qualification and prototype for engineering samples, releasing new product to production and market, etc.
• Capable of organizing, tracking assigned projects in details and completing projects on schedule.
• Conduct weekly meetings with internal fabs, foundries and package manufacturing to resolve any outstanding issues.
• Team with FAE’s, marketing and field offices to define new product specifications, to perform product competitive benchmark and analysis. Team closely with wafer source and packaging manufacturing on samples requests, new product development and releases, provide technical data sheets with complete specification of parameters. Ensure new product meets QA and yield standards and that specifications are set appropriately.
• Support manufacturing division’s mass production ramp up activities, such as recommendations for test equipment for mass production, requalifications for yield improvement, working with QRA on Product Change Notifications to customers, etc.
• Support FAE’s, marketing and field sales offices on product related issues to maximize sales.
• Capable of directing or performing characterization and testing product at the Engineering Lab.
• Other duties as assigned.

OTHER SKILLS:

• BSEE or Equivalent, 3 – 8 years experience as a Product Engineer or similar position
• MSEE or similar MS degree/MBA beneficial preferred
• Team player as well as be able to work independently, take ownership of responsibilities
• Familiar with discrete semiconductors; diodes, rectifiers and transistors
• Knowledge of discrete semiconductor fab and manufacturing processes
• Excellent communication skills, verbal and written, including presentations
• Ability to travel up to 35% including protracted trips overseas outside of the USA
• Self-directed, self-starter, and a proactive problem solver
• Proficient in Microsoft Office Environment
• Efficient time management skills, good work ethics
• Mandarin Chinese language skills desired, but not required

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DIODES INCORPORTD



WHO IS DIODES INCORPORATED?

 自1966年成为上市公司( Nasdaq: DIOD )

 总部和北美运输/货存中心坐落在美国加州的Westlake Village市

 约有大致有1300名员工(北美+亚洲).

 2003年销售额：一亿一千五百八十万美元

 拥有ISO-9000和 QS-9000认证的中国大陆和中国台湾工厂生产高质量低价格具竞争力的产品.

 Diodes-中国：独有的尖端制造技术,生产高可靠性高密度的表面贴装装置(SMD)，包括有SOT-23, SOD-123, SOD-323, SOT-323, SOT-363及更多

 厂商代表以及主要分销商组成的广阔网络进一步加强了产品的销售

 经营的产品包括小信号晶体管和MOS场效应管, 瞬态电压抑制二极管(TVSs), 齐纳, 肖特基, 二极管, 整流器和桥式,包装成轴式和表面贴装

 以顾客为中心的半导体分立元件制造生产商
美商DIODES Incorporated（上海凯虹电子有限公司）为美国纳斯达克(NASDAQ)上市公司，专业从事半导体电子零件（二、三极管, Analog IC）之研发、生产、销售。是全球半导体器件领域的先导企业。我们在欧美、亚太均有分支机构。目前除上海、深圳办事处外，亦有YOSUN、UPPERTECH、ZENITRON 等代理商扩展中国市场。现为扩大业务，需求下列人才。



欢迎您浏览我们的网站 www.diodes.com ; 我们热诚期待您加入DIODES的工作行列.

上海地址：上海市普陀区中山北路3000号长城大厦3001-02

深圳地址：深圳市南山区高新南四道8号创维半导体设计大厦东座16层