苏州招聘

职位描述：
Duties and Responsibilities
1. Responsible for Assembly Process Development and Characterization for Enabling Technology in Semiconductor FOL (Front of Line) area as Process Development Engineer
A. Capable to understand and discuss proposed design and new proposal upgraded
B. Capability understanding Design FMEA, upgrading DFMEA and making Process FMEA from DFMEA
C. Capability to define KPIV from FMEA Failures Modes
D. Capability to define KPOV and making result of KOPV and analysis from it
E. Responsible for providing Technical reports with satisfying KPIV versus KPOV from FMEA failures modes based on JMP analysis
F. Working with development engineers to generate and create documents deliverables such as preliminary Control Plan from D/PFMEA according to APQP procedure
G. Responsible for Sharing and Communication with Development Engineers and Manufacturing Engineers

2. Pro typing Line Sample Building and Line Equipments Maintenance & Management
A. Capable for Equipment and Tooling Set-up
B. Responsible for Tool and JIG design working with designers and vendors for new development tool designs (SMT process jig & tool design, Al & Au wire bonding clamp design, other jig design)
C. Responsible for readiness of tools and Jigs meeting target schedule without EON owner’s schedule impacts to generate proper outputs within schedule
D. Responsible to meet EON cycle time on Technology Development
E. Leading Proto Typing Line Operators to do right job
F. Sharing technical issues and new result to related EON owners and manufacturing engineering team

3.Technical Leadership on Assembly Process
A. Capable to initiate new Process and new Equipment working with development engineers and vendors
B. Responsible for PO Spec. generation and Buy-off
C. Capable to create COO for Process and Equipment Comparison
D. Capable for Benchmarking New and Better Process and Equipments that does not exist in company
E. Capability to create Assembly Technology Roadmap
F. Capability to generate Characterization and out of design Rule by Co-work with Dev. Engineer and NPI Process engineers
G. Capable to understand customer requirements, application, EHS and design
H. Capable to find technical and systematic solution and schedule for failures of process, reliability, quality, manufacturability, cost, and cycle time that are related with process
I. Supporting Production Related Quality Issues for Manufacturing
J. Leading the Pre-work and supporting Code-S with NPI Process Engineers
K. To share and update project progress, risk of delay, constraints by weekly report and update technical Web site and report to manager


Qualifications

1. Experienced years : Longer than 10 to 15 years in Sawing, Die attach, Wire bonding and SMT
2. Experienced areas : Sawing, Soft Solder Die Attach, Al wire bonding , Au wire bonding , Cu wire bonding SMT process (Screen Printing, Die Mounting, Reflow, Flux Cleaning)
3. Experienced jobs : Semiconductor Assembly Process Development, Equipment and Tooling set-up, process/equipment/material troubleshooting and control, Purchase spec/selection, Qualification for equipment and material, Experience of consulting on Leadframe design, Al & Cu wire bonding clamp design, Al & Au & Cu wire recipe and Screen Mask design
4. Experienced packages: Semiconductor Packages. Highly Preferred Power discrete (like TO220, D-Pak, D2PAK) and Power module packages (like SPM, IPM, IGBT/Diode module)
5. Education: 4yrs college or preferred Master Degree, Preferred Material Science or Metallurgical Engineering
6. Skills: Communication skills, written English and speaking with multi-cultural foreign engineers, JMP & Data analysis. Skilled Excel Spreadsheet and Power Point Presentation.
7. Other characteristics such as personal characteristics : Self motivated, independent, open mind to communicate, be willing to take risk and managing

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    苏州工厂是原Fairchild（快捷半导体）集团公司于2002年2月在中国设立的一家工厂。在2016年与安森美正式合并，公司坐落于苏州工业园区美丽的金鸡湖畔。2016年以来生产订单一直处于增长中，并不断扩产。公司现有员工1900多人，主要从事封测、产品开发和封装研发的业务。产品包含功率器件、模拟器件和功率模块，广泛运用于汽车、家电、消费电子等领域。

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