苏州招聘

职位描述：

Job Responsibilities:
1.Responsible for Assembly & Packaging development, qualification & NPI.
2.Lead new product development E2E from development phase through qualification and production ramp where the scope consists of packaging, assembly and bumping.
3.Design new packaging methodologies to meet business/customer requirements
4.Responsible for design for manufacturing (DFM) for the success of customer products.
5.Research the packaging materials, responsible for characterization, application and selection.
6.Work with Assembly Engineering to develop the equipment technology along with the package roadmap
7.Drive and work with Assembly Engineering and suppliers for yield improvement during NPI stage
8.Familiar with the quality and reliability test conditions and specifications.
9.Support critical customer issues, including investigation, experiment, simulations, etc.

Job Qualification:

-Education: Bachelor degree or above

-Language: Excellent oral and written skills in English and Mandarin

-Experience: 6~8years’ work experience including 3~5 years’ process expertise experience in a high paced environment 1.Project Management 2.Good understanding of Semiconductor processes. 3.Strong problem solving skills and ability to handle multiple projects concurrently. 4.Experience and knowledgeable in Flip Chip C4 Assembly and Packaging including materials and process 5.Experience and knowledgeable in substrate manufacturing process and wafer bumping is preferred. 6.Knowledge on Six Sigma and Lean, BB preferred.

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苏州通富超威半导体有限公司(TF-AMD）简介
1、通富微电子股份有限公司简介：
1997年10月成立，股票简称：通富微电，股票代码：002156。
公司总部位于中国江苏省南通市，旗下企业包括通富微电、南通通富、合肥通富、通富超威（苏州）和通富超威（槟城）等五大封测企业。公司是中国本土前三大集成电路封装测试企业，全球前十大半导体制造商一半以上是通富微电的客户。公司拥有国家认定企业技术中心、国家博士后科研工作站、江苏省企业院士工作站、省级工程技术研究中心和企业研究院等高层次研发平台。

2、超威半导体（AMD）简介：
AMD公司成立于1969 年，总部位于美国加利福尼亚州桑尼维尔。AMD（NYSE: AMD）是一家创新的科技公司，致力于与客户及合作伙伴紧密合作，开发下一代面向商用、家用和游戏领域的计算和图形处理解决方案。.AMD的业务遍布全球，拥有约为12000名员工。

3、苏州通富超威半导体有限公司（TF-AMD）
   公司位于中国苏州工业园区苏桐路88号，由通富微电子股份有限公司（通富微电）作为控股股东与美国超威半导体（AMD）共同合资成立。公司主要从事高端处理器芯片封装测试业务，满足从处理器半成品切割、组装、测试、打标、封装的五大CPU后期制造流程，同时具备对中央处理器（CPU）、图形处理器（GPU）以及加速处理器（APU）进行封装和测试能力，是通富微电旗下五大封测基地之一。

    诚挚邀请您加盟本公司，我们坚信能为员工提供具有竞争力的薪酬/福利和系统的培训机会（海外/本地）,以及广阔的职业发展前景。

公司地址：苏州工业园区苏桐路88号
招聘邮箱：szhr@tf-amd.com
招聘部负责人：李先生 EXT：37526