Senior /MTS Engineer of Physical Design (职位编号：MM)
超威半导体（中国）有限公司
- 公司规模：1000-5000人
- 公司性质：外资(欧美)
- 公司行业：电子技术/半导体/集成电路
职位信息
- 发布日期：2016-12-21
- 工作地点：上海-浦东新区
- 招聘人数：若干人
- 职位类别：集成电路IC设计/应用工程师
职位描述
职位描述：
Senior /MTS Engineer of Physical Design (Shanghai)
Job Description:
Work with global Front-End design team and physical design team for large scale ASIC chip physical implementation. Focus on physical design of deep sub-micron GPU chips including block level (full chip) floor planning, timing closure, place&route, physical verification etc. The individual is expected to be an expert in multiple aspects in PD areas and provide technically leadership to the engineering team. The individual is also expected to be accountable for project delivery.
Job Requirement:
1. MSEE with 6+ years or Bachelor with 8+ years of industrial experience in ASIC design
2. 5+ years or more years of experience in physical design of deep submicron digital ASIC chips
3. Hands on experience in large scale ASIC chip physical design
4. Knowledgeable in all aspects of deep submicron ASIC design flow
5. Successfully gone through several complete product development cycles
6. Demonstrate strong leadership and work well with cross-functional teams
7. Good listening, writing and speaking English
8. Good communication skills, strong interpersonal skills and the flexibility
9. Dedicated, hardworking and good team player
10. Familiar with Back-End (physical design) EDA tools
11. Familiar with Front-End EDA tools is a plus
12. Familiar with Unix/Linux environment and good at scripts
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Senior /MTS Engineer of Physical Design (Shanghai)
Job Description:
Work with global Front-End design team and physical design team for large scale ASIC chip physical implementation. Focus on physical design of deep sub-micron GPU chips including block level (full chip) floor planning, timing closure, place&route, physical verification etc. The individual is expected to be an expert in multiple aspects in PD areas and provide technically leadership to the engineering team. The individual is also expected to be accountable for project delivery.
Job Requirement:
1. MSEE with 6+ years or Bachelor with 8+ years of industrial experience in ASIC design
2. 5+ years or more years of experience in physical design of deep submicron digital ASIC chips
3. Hands on experience in large scale ASIC chip physical design
4. Knowledgeable in all aspects of deep submicron ASIC design flow
5. Successfully gone through several complete product development cycles
6. Demonstrate strong leadership and work well with cross-functional teams
7. Good listening, writing and speaking English
8. Good communication skills, strong interpersonal skills and the flexibility
9. Dedicated, hardworking and good team player
10. Familiar with Back-End (physical design) EDA tools
11. Familiar with Front-End EDA tools is a plus
12. Familiar with Unix/Linux environment and good at scripts
职能类别： 集成电路IC设计/应用工程师
公司介绍
AMD公司成立于1969年，总部位于美国加利福尼亚州桑尼维尔。AMD（NYSE: AMD）是一家创新的科技公司，致力于与客户及合作伙伴紧密合作，开发下一代面向商用、家用和游戏领域的计算和图形处理解决方案。AMD的业务遍布全球，拥有约为12000名员工。
联系方式
- Email：bella.yu@amd.com
- 公司地址：上海-浦东新区 张江 环科路669号凯瑞大厦