Application Engineer
赫比(苏州)通讯科技有限公司
- 公司规模:500-1000人
- 公司性质:外资(非欧美)
- 公司行业:电子技术/半导体/集成电路
职位信息
- 发布日期:2016-09-13
- 工作地点:上海-浦东新区
- 招聘人数:若干人
- 学历要求:专业培训
- 职位月薪:6000-7999/月
- 职位类别:其他
职位描述
职位描述:
This position is responsible for Hi-P’s business application requirements. The person needs to perform designing, programming, testing and implementation of application development. The person also needs to provide end user operational support for the application systems. 1. To evaluation & introduce new application system
2. To assist in application system implementation
3. To help customize reports and programs to support of the daily operations
4. To provide development documents and end-user training
5. To provide business application support to end-users
6. Assist in maintaining and up keeping of all the existing systems and programs
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This position is responsible for Hi-P’s business application requirements. The person needs to perform designing, programming, testing and implementation of application development. The person also needs to provide end user operational support for the application systems. 1. To evaluation & introduce new application system
2. To assist in application system implementation
3. To help customize reports and programs to support of the daily operations
4. To provide development documents and end-user training
5. To provide business application support to end-users
6. Assist in maintaining and up keeping of all the existing systems and programs
职能类别: 其他
公司介绍
赫比国际有限公司成立于1980年,是涉足机电模具、通讯业、消费电子和计算机业的领先供应商。我们多元化的服务涉及工业和产品设计,制造,组装以及配套增值服务如表面处理的精加工、外包制造以及精密金属冲压。
赫比公司的总部位于新加坡,全球共拥有15处工厂和技术支持中心。现有约20,000名雇员服务于赫比公司。
如果您希望了解更多的信息,欢迎登陆我们公司主页www.hi-p.com
Founded in 1980,Hi-P is a leading supplier of electro-mechanical modules to the telecommunications, consumer electronics and computing industries. Our diversified service offering ranges from industrial and product design, manufacture, assembly, ancillary value –added services such as surface decoration finishing and precision metal stamping as well as turnkey contract manufacturing.
Headquartered in Singapore, Hi-p has an extensive footprint with 15 manufacturing plants globally and engineering-support centers. We currently employ about 20,000 people.
For more information, please review our website: www.hi-p.com
赫比公司的总部位于新加坡,全球共拥有15处工厂和技术支持中心。现有约20,000名雇员服务于赫比公司。
如果您希望了解更多的信息,欢迎登陆我们公司主页www.hi-p.com
Founded in 1980,Hi-P is a leading supplier of electro-mechanical modules to the telecommunications, consumer electronics and computing industries. Our diversified service offering ranges from industrial and product design, manufacture, assembly, ancillary value –added services such as surface decoration finishing and precision metal stamping as well as turnkey contract manufacturing.
Headquartered in Singapore, Hi-p has an extensive footprint with 15 manufacturing plants globally and engineering-support centers. We currently employ about 20,000 people.
For more information, please review our website: www.hi-p.com
联系方式
- 公司地址:上班地址:苏州市吴中区郭巷街道河东工业园区六丰路86号