Product/NPI/Program Manager
技领半导体(上海)有限公司
- 公司规模:150-500人
- 公司性质:外资(欧美)
- 公司行业:电子技术/半导体/集成电路
职位信息
- 发布日期:2015-06-18
- 工作地点:上海
- 招聘人数:1
- 工作经验:5-7年
- 学历要求:本科
- 语言要求:英语熟练
- 职位月薪:面议
- 职位类别:工艺工程师
职位描述
Job Description:
1.Program management of new project/product/package introduction activities.
2.Organize, plan and direct program schedules, responsible for tracking relevant, timeline, metrics and drive action items based on results. Highlight program risks and provide suggestions for resolving/minimizing risks.
3.Coordinate with internal and external team since product definition stage on the project progress to meet the 1st silicon
sample submission & RTP goal.
4.Engage with packaging design feasibility & solution with OSAT.
5.Knowledge of qualification process for NPI as well as JEDEC requirements.
6.Drive prototype and pilot builds in subcon, including CT and quality expectations, review and release related documents to subcon.
7.Drive subcon on yield improvement when product ramp up and mass production.
8.Work with QA in subcon yield, quality issue to meet company standard.
9.Reviews and influences manufacturing capacity / capability, design stability, risk planning.
10.Provide solutions to customer issues as well as interacting with both internal and external customers.
11.Formulate process flowsand SOPs.
12.Other responsibility to be assigned based on the business needs.
Job Requirements & Education:
1. Bachelors or Masters Degree in Engineering and Science.
2. Minimum 2~5 years experience as NPI, Product or Process Engineer in a semiconductor assembly and test manufacturing facility, or 2 ~5 years experience as NPI, Product or Program Manager/Engineer in a semiconductor product design house
3. Basic knowhow of IC product development flow.
4. Familiar with autoCAD, CAM or other design tool, as well as MS office appllication.
5. Has basic knowledge of engineering analysis tool (basic statistical tools) and QC Tools (pareto, 8D, trend chart, etc)
6. Basic know how of both fab and back end assembly manufacturing process.
7. Knows the basics of packaging technology such as SOIC, SOT, QFN, Flip chip and WLCSP.
8. Ability to use typical FA equipment and knowledge on IC/packaging FA.
9. Can work with all level of people and can work under pressure.
10. Good Mandarin and English communication skills
1.Program management of new project/product/package introduction activities.
2.Organize, plan and direct program schedules, responsible for tracking relevant, timeline, metrics and drive action items based on results. Highlight program risks and provide suggestions for resolving/minimizing risks.
3.Coordinate with internal and external team since product definition stage on the project progress to meet the 1st silicon
sample submission & RTP goal.
4.Engage with packaging design feasibility & solution with OSAT.
5.Knowledge of qualification process for NPI as well as JEDEC requirements.
6.Drive prototype and pilot builds in subcon, including CT and quality expectations, review and release related documents to subcon.
7.Drive subcon on yield improvement when product ramp up and mass production.
8.Work with QA in subcon yield, quality issue to meet company standard.
9.Reviews and influences manufacturing capacity / capability, design stability, risk planning.
10.Provide solutions to customer issues as well as interacting with both internal and external customers.
11.Formulate process flowsand SOPs.
12.Other responsibility to be assigned based on the business needs.
Job Requirements & Education:
1. Bachelors or Masters Degree in Engineering and Science.
2. Minimum 2~5 years experience as NPI, Product or Process Engineer in a semiconductor assembly and test manufacturing facility, or 2 ~5 years experience as NPI, Product or Program Manager/Engineer in a semiconductor product design house
3. Basic knowhow of IC product development flow.
4. Familiar with autoCAD, CAM or other design tool, as well as MS office appllication.
5. Has basic knowledge of engineering analysis tool (basic statistical tools) and QC Tools (pareto, 8D, trend chart, etc)
6. Basic know how of both fab and back end assembly manufacturing process.
7. Knows the basics of packaging technology such as SOIC, SOT, QFN, Flip chip and WLCSP.
8. Ability to use typical FA equipment and knowledge on IC/packaging FA.
9. Can work with all level of people and can work under pressure.
10. Good Mandarin and English communication skills
公司介绍
Active-Semi means innovation. From power management ICs that enhance mobile equipment performance to energy-saving power conversion architectures, our products exceed the demands of today's advanced power applications.
Our R&D team pioneers advanced design methodology in delivering innovative portable power solutions. Active-Semi's core ActivePMUTM platform of digital and programmable Power Management Unit (PMU) ICs revolutionize today's power design and management in portable equipment such as smart phones, portable navigation devices, and personal media players. Our multiple patent-pending designs result in a wide range of products and solutions that deliver the highest integration, best performance, fastest time to market, and smallest foot print. These ActivePMUs are optimized for supplying to and managing power in applications where maximum battery life and smallest size are paramount, especially systems using today's most advanced mobile processors.
Our ActivePMUTM family of digital Primary-Side Regulation (PSR) controllers simplify today's AC/DC designs with low component-count, and exceed all green power efficiency standards.
Founded in 2004 in Silicon Valley, California, Active-Semi has assembled an international team of industry experts, and delivered a differentiating innovative product portfolio. We continuously develop new intellectual property-18 patents have been filed-to provide leading edge solutions. Our engineering team uncompromisingly pursues industry's highest quality standard in product design and production.
"Team Active" currently comprises more than 170 people in the United States and worldwide. We have established advanced research and development centers, ISO9001:2000 certified operation, and sales presence in the United States, Europe, Korea, People's Republic of China, China Hong Kong, China Taiwan, and Vietnam.
The Active-Semi logo, ActivePMUTM, and ActivePSRTM are trademarks of Active-Semi International, Inc., Scotia Centre, P.O. Box 268GT, Grand Cayman, Cayman Islands.
Active - Semi was acquired by Qorvo on May 7, 2019.
We are looking forward to your joining. If you
— possess creativity and skills
— are able to finish jobs independently and value team work
— want an environment of continuous study and innovation,
then we are the company for you. Joining ACTIVE, you will thrive in the environment of enterprising spirit and hard-working culture. You will find a platform for you to show your capabilities and talents.
Our R&D team pioneers advanced design methodology in delivering innovative portable power solutions. Active-Semi's core ActivePMUTM platform of digital and programmable Power Management Unit (PMU) ICs revolutionize today's power design and management in portable equipment such as smart phones, portable navigation devices, and personal media players. Our multiple patent-pending designs result in a wide range of products and solutions that deliver the highest integration, best performance, fastest time to market, and smallest foot print. These ActivePMUs are optimized for supplying to and managing power in applications where maximum battery life and smallest size are paramount, especially systems using today's most advanced mobile processors.
Our ActivePMUTM family of digital Primary-Side Regulation (PSR) controllers simplify today's AC/DC designs with low component-count, and exceed all green power efficiency standards.
Founded in 2004 in Silicon Valley, California, Active-Semi has assembled an international team of industry experts, and delivered a differentiating innovative product portfolio. We continuously develop new intellectual property-18 patents have been filed-to provide leading edge solutions. Our engineering team uncompromisingly pursues industry's highest quality standard in product design and production.
"Team Active" currently comprises more than 170 people in the United States and worldwide. We have established advanced research and development centers, ISO9001:2000 certified operation, and sales presence in the United States, Europe, Korea, People's Republic of China, China Hong Kong, China Taiwan, and Vietnam.
The Active-Semi logo, ActivePMUTM, and ActivePSRTM are trademarks of Active-Semi International, Inc., Scotia Centre, P.O. Box 268GT, Grand Cayman, Cayman Islands.
Active - Semi was acquired by Qorvo on May 7, 2019.
We are looking forward to your joining. If you
— possess creativity and skills
— are able to finish jobs independently and value team work
— want an environment of continuous study and innovation,
then we are the company for you. Joining ACTIVE, you will thrive in the environment of enterprising spirit and hard-working culture. You will find a platform for you to show your capabilities and talents.
联系方式
- 公司地址:地址:span上海张江高科技园区祖冲之路1077号凌阳大厦1202室