苏州招聘

Responsibilities
1. Subject matter expert in molding, trim and forming processes and tool & die engineering.
2. Develop Center of Excellence framework for all Power Module EOL Processes, with initial & primary focus on Automotive Power Modules (APM).
3. Establish zero defects & firewall strategies for EOL Processes.
4. Improve quality management systems. Define quality sensitivity guideline and risk assessment procedures.
5. Consolidate/ Organize/ Define and Institute Best Practices, Material and Process Design Rules, Material & Process Characterization Methodologies.
6. Review and assess material & tooling changes and the interaction to the process and the product. Assess design risk & provide contingency plans and conduct cost/benefit trade-off analysis of design issues.
7. Guide / manage equipment technology & platform standardization. Enhance/develop tooling management systems.
8. Collaborate with Manufacturing, Process Engineering, NPI Engineering, and Development Engineering & Quality Engineering to institute CoE programs.
9. Work directly with Equipment Engineering and Technical staff to resolve daily production issues with short term, immediate solutions, while plan strategically to prevent re-occurrence over long term.
10. Champions the technical training and certification for EOL Processes and Materials.
11. Will cover Customer Engineering responsibility. Have the capability to assess constraints and influence decisions for efficient and reliable solutions.
12. Oversees the Automotive Operations Review, Quality Control Circle (QCC) Programs and Automotive Quality Task Force Programs installed in Fairchild Suzhou.
13. Lead colleagues through disciplined sound practices.
14. Other responsibility to be assigned based on the business need.

Qualifications
1. Bachelor’s degree in Mechanical/ Electronics/ Electrical Engineering or in Sciences – Physics/ Chemistry.
2. Minimum 10 years experience semiconductor Assembly - EOL Processes. With vast experience in molding and tool & die engineering. Hands-on experience is of great advantage.
3. Must have knowledge in Engineering Statistics & Data Analysis, FMEA, APQP, 8D and other Built-in Quality Tools. With excellent problem solving skills to overcome challenges quickly and effectively.
4. Must have excellent knowledge in Epoxy Mold Compounds (EMC) properties and characteristics.
5. Well versed in interpreting (read & write) mechanical working drawing in Auto-CAD & Solid Works.
6. Must be a team leader, highly motivated with good decision making, inter-personal & documentation skills.
7. Confident and comfortable in large meeting settings where differences of ideas and information exist.
8. Has the ability to produce high quality, descriptive and yet concise, presentation materials.

PS ： Resume need both Chinese & English
有意者请同时登陆以下地址，进行在线申请。请在区域栏（Location）中选择（Jiangsu）谢谢！
http://careers.fairchildsemi.com/

   安森美半导体苏州是全球首屈一指，针对多元终端市场提供高性能功率产品的全球第二大供应商。1999 年，安森美半导体从摩托罗拉分离出来，于 2000 年成为一家上市公司。
    苏州工厂是原Fairchild（快捷半导体）集团公司于2002年2月在中国设立的一家工厂。在2016年与安森美正式合并，公司坐落于苏州工业园区美丽的金鸡湖畔。2016年以来生产订单一直处于增长中，并不断扩产。公司现有员工1900多人，主要从事封测、产品开发和封装研发的业务。产品包含功率器件、模拟器件和功率模块，广泛运用于汽车、家电、消费电子等领域。

请同时提供中英文简历并注明应聘职位及期望薪资，您也可以登录 http://www.onsemi.com了解公司情况以及招聘职位的详细信息。此外国内招聘网站公司仅使用51Job和苏州圆才网。

乘车路线：100，28，142，207路到加城大厦站下车，往南走200米。
26，27，307，518，818路到苏桐路站下车，往南走50米。