苏州招聘

Job Recruitment

a.Bachelor and above , major in Mechanical, Material; Electronic Engineering. 5 years above of Semiconductor Assembly FOL experience.
b. 3 years Experience of DA process.
c.Familiar with QC tools, FMEA and other problem solving method.
d.Familiar DOE and other statistical analysis experience will be strongly considered.
e.Good logical thinking and present skills, can work under high pressure.
f.Good English communication skill.

Job Description

a. Fully Support New Product Introduction, equipment, material, qualification for DA process.
b.In-charge for new equipment and tooling purchasing and process setup.
c. Establish engineering process flow, control, SOP for different packages.
d.UPH improvement for capacity up and OEE improvement.
e.Managing engineering yield for each product, customer, daily disposition for hold lot. low yield lot, weekly, monthly report for each customer with improvement action.
f.Systematic problem solving approach and closure of 8D, PC-CAR, HER, etc..
g.Ownership of capacity plan, control and utilization

无锡市太极实业有限公司是江苏省首家上市公司。公司主营业务化纤、纺织和服饰服装，2008年，在原有的产业基础上拓展了半导体制造业务，与韩国海力士半导体合资成立控股子公司无锡海太半导体。
2013年1月，太极实业与香港科錋友联有限公司共同投资在苏州工业园区注册成立太极半导体（苏州）有限公司和太极微电子（苏州）有限公司，主要进行半导体产品的研究、开发、封装、测试及生产，并提供相应的售后服务。
太极半导体(苏州)有限公司和太极微电子（苏州）有限公司是太极实业在现有海太半导体外打造的一个新的独立完整的半导体发展平台，有利于公司获得独立的半导体研发队伍及市场销售队伍，有利于公司巩固和发展在半导体领域内的发展成果,增强公司在半导体行业的整体竞争力，进一步完善公司的半导体业务布局。