苏州招聘

Responsibilities

·Sustain current package designs for improvements in quality, cost, transport and handling efficiency.

·Direct ODM & Logitech internal quality resources in receipt/approval of new package parts.

·Process engineering, DFMA skill sets, communicating with vendors, help identify and improve their processes.

·Lead package engineering vendors and be responsible for effectively managing the end to end development process to meet or exceed packaging targets - including design innovation, cost, quality and schedule,

·Perform necessary tests on new package designs to ensure compliance with Logitech qualification criteria. Provide required written test results.

·Improve packaging design to support producibility and/or cost savings.

· Contribute to the evolution of Logitech packaging design and qualification procedures to suit retail supply chain environment.

Requirements

· Thorough knowledge of manufacturing processes and the ability to design within reasonable limits of these processes.

· Expert knowledge of packaging materials and their usages including, but not limited to, corrugated paper, art paper, plastics, wood, and metals.

· Deep knowledge of printing and process such as file//proof/laminate/UV coatings, etc.

· ISTA/ASTM knowledge a must.

· Knowledge and usage of Artios CAD

· Thorough knowledge of packaging assembly process include manual assembly, blister pack heat, RF and other methods of sealing/tamper proofing retail packages.

· Ability to develop and document qualification and inspection protocol for packaging materials and systems.

· Knowledge of costs associated with different materials used in package design

· Be knowledgeable of all types of packaging materials and their usages such as corrugated paper, art paper, plastics, acrylic, etc.

·Knowledge of freight methods used for distribution of retail products

·General knowledge of graphic printing, associated equipment and materials (inks, coatings, etc)

·General knowledge of environmental regulations/initiatives related use of packaging materials

· Ability to analyze, debug and suggest solution for package design issues/challenges

· Superior communication skills required.

· Strong Leadership ability in order to work with vendors/suppliers to get our packages manufactured to the highest levels of quality and appearance.

· Excellent English language skills

· Education: BS in Packaging Engineering or equivalent

· 5-7 years of experience in packaging design and engineering

瑞士罗技电子是世界知名的电脑周边设备供应商，其业务范围涵盖市场拓展、产品规划、设计研发、生产制造与物流服务。罗技在美国加州的Fremont、瑞士洛桑的Romanel，以及中国台湾的新竹科学园区等地设有营运总部。此外，在世界各主要国家，如德国、法国、荷兰、爱尔兰、新加坡与日本，均设有分公司或营销中心。

    罗技的产品主要包括鼠标、键盘、音箱、网络摄像头、游戏周边设备，游戏控制装置等。其优异的品质和完善的服务得到IBM、HP、DELL、Sony、Toshiba等在内的全球20多家知名厂商的高度认可。

    满足客户需求、注重科技发展、稳定的结构与积极的环境、创新、扩充、迅速响应的态度——正是这些最为简单却又至关重要的元素，推动着我们不断向前，促成了“罗技”这一个家喻户晓的品牌。

    位于苏州新区的罗技科技（苏州）有限公司（原“苏州罗技电子有限公司”）为罗技全球***的产品制造基地之一。成立于1994年2月并经过十余年不断的发展，现已成为年销售额达4亿美元，苏州地区出口额***的企业之一。2005年7月，罗技位于新区嵩山路占地面积达13万平方米的全新标准化厂房已正式投产，崭新的环境和产能的扩大，必将使我们更为自信地迎接来自全球资讯电子业的挑战。

    成立于2001年的罗技科技苏州研发中心是罗技公司位于中国最核心的研发部门，主要从事罗技产品的设计、开发、验证等相关工作。经过多年历练与成长，我们现今已发展成为一支技术力量雄厚、经验丰富的专业研发团队，团队成员拥有多年产品研发经验，也是罗技全球战略的重点之一。我们坚信能为员工提供舒适人性化的工作环境、极具竞争力的薪酬/福利和系统的培训机会,以及广阔的职业发展前景。在中国成为全球最重要的经济体的同时，我们真诚邀请您加入我们，一起携手共创罗技新的辉煌。

    在罗技，优秀的人才始终是推动公司不断发展的原动力。我们尊重知识、尊重人才，强调专业技能和素质的持续学习与进步，提升员工自身价值，并为表现优秀的员工提供职业发展规划与海外培训机会。

    我们期待您的加入，携手共进，共享机遇与挑战！

公司地址：苏州高新区嵩山路3号
公司招聘官网： https://jobs.jobvite.com/logitech