苏州招聘

1) To develop derivative power semiconductor module packages
2) With existing and matured package, develop new products changing die size, die thickness, number of wires, increased die size, increased wire size, reflecting new mold compound,new die attach material, etc
3) To develop IGBT and MOSFET module packages for motor control, inverter, converter for commercial, industrial and automotive
4) Achieve business goal of new products in view points of product electrical, thermal, reliability, manufacturerability,cost and time to market
5) Lead and collaborate with individual process development engineering, QRA, Equipment Engineering, project management, production to develop new products meeting business goal
6) Follow company advanced product quality planing,(APQP) spec aligned with JEDEC APQP spec
7) Design process, lead frame, substrate, material, reliability, quality control for new package development
8) Reporting to Section manager and engineering director
9) Individual contributor without subordinate
10) Member for engineering department with around 30 members

Career requirement:
1) 4 yrs university or college graduated in Physics, Chemistry, electronic engineering, electric engineering, or equivalent
2) Master and Dr will get advantage
3) Minimum 3 yrs of package development hands on skill required
4) Minimum 6 yrs semiconductor package or assembly engineering background required
5) Understanding of failure analysis and able to plan failure analysis for reliability and electrical test failure
6) Good understanding on material science

我们公司主要负责世界500强欧美企业，且主要负责制造业：机械、电气、电子等行业；