苏州招聘

Requirement:

1. 4 years university graduated or masters in Physics, Chemistry, Electronics Engineering, Electric engineering, etc equivalent majors of engineering.
2. Maters will get advantages
3. Minimum 5 yrs of engineering skill in mold, trim/form and plating
4. Must understand mold, trim, form, deflash and plating, parameters and material properties to characterize and optimize process according to reliability, quality and manufacturability requirement
5. Able to design mold, Trim, form die against bent leads, delamination, lead diemension and visual inspection
6. Able to operate conventional mold, auto mold, trim and form equipment
7. Understand Design FMEA, process FMEA, RPN, Failure mode, JMP, DOE, lean Six Sigma, Measurement system analysis, and Statistic Analysis
8. Good English for reading and writing to generate engineering characterization report as 2nd language
9. 1st Language requirement : Chinese Mandarin

Roles and Responsibility:

1. New product introduction as a assembly end of line engr of mold, trim, form for IGBT, MOSFET, and Diod power module.
2. Direct Reporting to Senior Engineer and reporting to engineering director
3. Responsible for mold, trim and form process characterization for power module to release new product in time meeting quality, reliability, manufacturability requirement of project.
4. Responsible for Design review to mass production yield, cycle time, quality, reliability, working instruction, control plan, FMEA for SMT, cleaning and reflow process.
5. Responsible Mold. Trim. Form process for mass production until transfer the project to process engineering.

   安森美半导体苏州是全球首屈一指，针对多元终端市场提供高性能功率产品的全球第二大供应商。1999 年，安森美半导体从摩托罗拉分离出来，于 2000 年成为一家上市公司。
    苏州工厂是原Fairchild（快捷半导体）集团公司于2002年2月在中国设立的一家工厂。在2016年与安森美正式合并，公司坐落于苏州工业园区美丽的金鸡湖畔。2016年以来生产订单一直处于增长中，并不断扩产。公司现有员工1900多人，主要从事封测、产品开发和封装研发的业务。产品包含功率器件、模拟器件和功率模块，广泛运用于汽车、家电、消费电子等领域。

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乘车路线：100，28，142，207路到加城大厦站下车，往南走200米。
26，27，307，518，818路到苏桐路站下车，往南走50米。