苏州招聘

RNR
1) To develop derivative power semiconductor module packages
2) With existing and matured package, develop new products changing die size, die thickness, number of wires, increased die size, increased wire size, reflecting new mold compound,new die attach material, etc
2) To develop IGBT and MOSFET module packages for motor control, inverter, converter for commercial, industrial and automotive
3) Achieve business goal of new products in view points of product electrical, thermal, reliability, manufacturerability,cost and time to market
4) Lead and collaborate with individual process development engineering, QRA, Equipment Engineering, project management, production to develop new products meeting business goal
5) Follow Fairchild advanced product quality planing,(APQP) spec aligned with JEDEC APQP spec
6) Design process, lead frame, substrate, material, reliability, quality control for new package development
7) Reporting to Section manager and engineering director
8) Individual contributor without subordinate
9) Member for engineering department with around 30 members
3. Career requirement
1) 4 yrs university or college graduated in Physics, Chemistry, electronic engineering, electric engineering, or equivalent
2) Master and Dr will get advantage
3) Minimum 3 yrs of package development hands on skill required
4) Minimum 6 yrs semiconductor package or assembly engineering background required
5) Understanding of failure analysis and able to plan failure analysis for reliability and electrical test failure
6) Good understanding on material science

上海威峰电子科技有限公司是港商独资企业，集团下属有：成都威峰电子有限公司、苏州行政办事处、上海业务承接及销售办公室。
上海分公司位于松江出口加工区。公司下属公司通过了ISO—9001:2000质量管理体系认证、QS9000质量管理体系认证和16949质量管理体系认证以及ISO14000环境管理体系认证。
公司生产多种型号PCB及封装测试产品。同时涉及半导体行业专业人员培训、管理及市场信息统计。产品远销欧美、东南亚及中国港澳地区。