苏州招聘

Responsibilities:

1. Responsible for calculating linear and non-linear stress, strain and deflection using FEA software.

2. Implement thermal analysis techniques to forecasting package/system level design risk and optimize design.

3. Calibrate modeling results based on measurement results and improve modeling accuracy.

4. Introduce advanced modeling simulation methods or tools to enhance RD simulation capability.

5. Support to explain engineer questions using modeling methodology.



Requirements:

1. Bachelor degree or above, master is preferred; Major in mechanical engineering or material science.

2. At least 2-year hand-on simulation experience in the field in mechanical and thermal using Ansys

3. Experience in IC assembly or familiar with Moldflow,/Icepak/Flotherm/ Fluent is a plus.

上海威峰电子科技有限公司是港商独资企业，集团下属有：成都威峰电子有限公司、苏州行政办事处、上海业务承接及销售办公室。
上海分公司位于松江出口加工区。公司下属公司通过了ISO—9001:2000质量管理体系认证、QS9000质量管理体系认证和16949质量管理体系认证以及ISO14000环境管理体系认证。
公司生产多种型号PCB及封装测试产品。同时涉及半导体行业专业人员培训、管理及市场信息统计。产品远销欧美、东南亚及中国港澳地区。