苏州招聘

To improve technical competency of SCC (no R&D expertise available for NAND packaging) in developing robust TSOP packaging solution and expanding our penetration into growing NAND market.
Key Job Accountabilities (Actual daily deliverables):
?Provide robust packaging solutions for TSOP/FBGA packages.
?Perform Technical Risk assessment and develop process solutions to achieve cost effective and high yielding products
?Competitive process/product benchmarking within and outside of company
?Work with D&C to develop design rules using DFM (Design for Manufacturability) approach
?Standardization of BOM, process & toolings across customers to ensure Lean Manufacturing
?Working with material supplier to develop solutions that can improve assembly COO (Cost of Ownership)


Required Experience and Qualifications (Required knowledge, skills and experience---however acquired):
Degree in Engineering / Science ( ECE / ME / EE / COE )
Minimum 7 year's or above related assembly experience in TSOP stacked die packages.
Able to demonstrate good understanding/knowledge on leadframe design, material selection and reliability for TSOP packages
Hands-on & working knowledge on all or some of the below technical challenges : Die-Attach Film qualification, Wire-In-Film, Thin die (below 75 um) handling, low wireloop characterization, Developing wirebonding process for Ni-Pd bondpad, Process development for Wide Substrate / Multi-row leadframe, Die-to-die bonding, Resolving Warpage / Die-crack issue, etc
Experience in managing customer projects and ramping up High Volume Production
Knowledgeable in use of statistical tools such as Variability charts for commonality analysis, DOE, pareto charts through SAS Jump application. Process capability -CPK 6 sigma applications , SPC and QC tools.
Flexible , can extend working time if necessary , can work under pressure and with minimal supervision.

上海威峰电子科技有限公司是港商独资企业，集团下属有：成都威峰电子有限公司、苏州行政办事处、上海业务承接及销售办公室。
上海分公司位于松江出口加工区。公司下属公司通过了ISO—9001:2000质量管理体系认证、QS9000质量管理体系认证和16949质量管理体系认证以及ISO14000环境管理体系认证。
公司生产多种型号PCB及封装测试产品。同时涉及半导体行业专业人员培训、管理及市场信息统计。产品远销欧美、东南亚及中国港澳地区。