苏州招聘

Job Description:
1. Improve yield, quality and make the process simplification through process evaluations or characterization, DOE optimization.
2. Establish process operating specifications/procedures, engineering change notice, and other DCC documents etc. 3. Establish control systems, line support and implementation on new/modified process and equipment developments, implements and maintains process techniques.
4. Recommend, evaluate and procure new equipment/material/process as part of VE programs enhancing company's competitiveness through higher output and lower cost.
5. Sustain production line with plating recipe setup and daily yield tracking
6. Dispose the problematic direct/indirect material in the line daily.
7. Review the customer plating spec. and transfer to plating recipe if any reversion
8. Provide necessary corrective & preventive action plans for customer-generated CARs ( Corrective Action Plan) or audit findings by working with CFT(Cross Function Team) groups
9. Recommend and provide error proof design or system upgrade and modifications to facilitate process margin improvement.
10. Implement system installations to minimize production downtime and improve safety while being cost efficient. 11. Support new package development or transfer through establishing processes, equipment / material during LVM(Low Volume Manufacturing) stage by working with NPI team
12. Qualify new material and equipment to meet process requirement and manage CCB (Change Control Board) ( VE/Improvements/Customer or supplier change)
13. Provide training to operation/Technician for their skill up
14. System development ( quality control/ process control) ( CIM/RMS/PCSD/E-system)
15. Escalates any non-conformant problems or issues to management.
16. Perform any other duties as assigned by supervisor

Competency, Skill and Knowledge requirments:
1. Understand plating machine operation system and configuration .
2. Understand plating machine working flow and key factors of CTQ ( Critical To Quality)
3. Understand plating working theory and key factors of CTQ.
4. Have the capability of problem solving (root cause analysis) on basic process defects and quality issue likes lot mixing and wrong plating.
5. Familiar with IRR/QRR or other quality manage system and be able to dispose the hold lots with corrective mindset and decision.
6. Be able to analyze this POR data to drive continuous improvement in equipment and process performance.
7. Be able to schedule Equipment and process modifications, prepares cost estimates, bid sheets and plan layouts. 8. Have good skill to confer with cross-functional teams to solve technical /engineering process issues.
9. Be able to drive continuous improvements of lead base products on safety, efficiency, yield, cost, and manufacturability through RCA skill
10. Be able to utilize statistical process controls tools( ex. QC 7 tools) and DOE /JMP application software
11. Be able to utilize AutoCAD and MS office software for continue improvement design, presentation and reporting.

12. Knowledge on electrochemistry and metal plating.
13. Understand plating chemical function in plating process.
14. Have good English skill both in written and oral
15. Have more than 5 years experience on plating process in semiconductor industry
16. Have bachelor degree on science and industry

上海威峰电子科技有限公司是港商独资企业，集团下属有：成都威峰电子有限公司、苏州行政办事处、上海业务承接及销售办公室。
上海分公司位于松江出口加工区。公司下属公司通过了ISO—9001:2000质量管理体系认证、QS9000质量管理体系认证和16949质量管理体系认证以及ISO14000环境管理体系认证。
公司生产多种型号PCB及封装测试产品。同时涉及半导体行业专业人员培训、管理及市场信息统计。产品远销欧美、东南亚及中国港澳地区。