EOL Punch engineer
上海威峰电子科技有限公司
- 公司规模:500-1000人
- 公司性质:合资(非欧美)
- 公司行业:电子技术/半导体/集成电路
职位信息
- 发布日期:2014-02-19
- 工作地点:上海
- 招聘人数:1
- 职位月薪:面议
- 职位类别:半导体技术
职位描述
? Implement error proof design or system installations to minimize production excursion and yield up and improve safety while being cost efficient.
? Working for QFNp transfer project of Punch process set up and development, make sure Qualification pass .
? Coordinate EOL UPH projects by modifying the tooling or equipment.
? Be able to analyze this data to drive continuous improvement in equipment and process performance.
? Lead a team to design and conduct experiments throughout product manufacturing stages to characterize engineering process windows.
? Confer with cross-functional teams to solve technical engineering process issues.
? Drive continuous improvements in QFNp product safety, efficiency, yield, cost, and manufacturability.
? Utilize statistical process controls, semiconductor process controls and equipment, metrology and support equipment.
To perform this job successfully, an individual must be able to perform each essential duty satisfactorily. The requirements listed below are representative of the knowledge, skill and/or ability required.
Minimum bachelor's degree Major in Mechanical or Engineering with a minimum of 4 years package punch equipment/process experience in IC assy plants or tooling design /manufacture experience .
Good tooling design and manufacture experience/ communication skills in English / Engineering data analysis skill
Responsible for QFNp PKG transfer project on Punch process and HVM yield/Quality performance, working to insure production quality output. Work with cross function team to meet assigned process engineering, production and value engineering and quality metrics.
UG/PRoE/CAD ; office software ; QC 7 tools ; JMP ; Tooling or automatic equipment manufacture
? Working for QFNp transfer project of Punch process set up and development, make sure Qualification pass .
? Coordinate EOL UPH projects by modifying the tooling or equipment.
? Be able to analyze this data to drive continuous improvement in equipment and process performance.
? Lead a team to design and conduct experiments throughout product manufacturing stages to characterize engineering process windows.
? Confer with cross-functional teams to solve technical engineering process issues.
? Drive continuous improvements in QFNp product safety, efficiency, yield, cost, and manufacturability.
? Utilize statistical process controls, semiconductor process controls and equipment, metrology and support equipment.
To perform this job successfully, an individual must be able to perform each essential duty satisfactorily. The requirements listed below are representative of the knowledge, skill and/or ability required.
Minimum bachelor's degree Major in Mechanical or Engineering with a minimum of 4 years package punch equipment/process experience in IC assy plants or tooling design /manufacture experience .
Good tooling design and manufacture experience/ communication skills in English / Engineering data analysis skill
Responsible for QFNp PKG transfer project on Punch process and HVM yield/Quality performance, working to insure production quality output. Work with cross function team to meet assigned process engineering, production and value engineering and quality metrics.
UG/PRoE/CAD ; office software ; QC 7 tools ; JMP ; Tooling or automatic equipment manufacture
公司介绍
上海威峰电子科技有限公司是港商独资企业,集团下属有:成都威峰电子有限公司、苏州行政办事处、上海业务承接及销售办公室。
上海分公司位于松江出口加工区。公司下属公司通过了ISO—9001:2000质量管理体系认证、QS9000质量管理体系认证和16949质量管理体系认证以及ISO14000环境管理体系认证。
公司生产多种型号PCB及封装测试产品。同时涉及半导体行业专业人员培训、管理及市场信息统计。产品远销欧美、东南亚及中国港澳地区。
上海分公司位于松江出口加工区。公司下属公司通过了ISO—9001:2000质量管理体系认证、QS9000质量管理体系认证和16949质量管理体系认证以及ISO14000环境管理体系认证。
公司生产多种型号PCB及封装测试产品。同时涉及半导体行业专业人员培训、管理及市场信息统计。产品远销欧美、东南亚及中国港澳地区。
联系方式
- 公司地址:地址:span松江出口加工区