苏州招聘

Duties and Responsibilities:

1) Process engineering: semiconductor wafer manufacturing processing, MEMS & MEMS manufacturing process engineering:
a. MEMS manufacturing process improvement, development, new process material evaluation and introduction.
b. Yield and quality improvement, cost reduction.
c. Supporting MEMS device assembly engineering needs.
2) New product (new MEMS device) introduction:
a. New MEMS device evaluation, characterization.
b. Deep co-work with R&D: new MEMS design optimization, new MEMS Proto type to mass production.
c. Deep co-work with MEMS foundry: yield and quality improvement, capacity improvement and cost reduction, foundry process development associated engineering activities.
3) Project management:
a. Process development project.
b. 2nd source foundry introduction/development project.
c. Cost reduction project.

Job Specifications

1) Bachelor/Master Degree in semiconductor physics & device engineering, semiconductor manufacturing process engineering, material engineering, chemistry & chemical engineering.
2) 4 years and above experience in semiconductor wafer manufacturing process engineering. At least 3 years’ experience in wafer Fab. is a must. Etching process (especially wet etching) engineering or wafer Fab process integration engineering (PIE) background is preferred.
3) Knowledge to MEMS device and MEMS process is preferred.
4) Familiar with wafer manufacturing process integration, wafer manufacturing process flow, wafer Fab. function modules.
5) Strong sense of quality control and cost-saving. Familiar with metrology tools and FA.
6) Strong willingness of learning. Ability to work independently and team work sprit. Good team leading and project management skills. Willingness to work under pressure. Proficiency in English speaking and writing. Good communication skill.

Knowles Corporation（纽交所代码：KN）创立于1946年，是全球领先的微型声学解决方案及专业元件供应商，服务领域涉及移动通讯、消费电子、医药科技、军事、航空航天和工业市场。在智能手机、平板电脑和移动通讯领域，楼氏的微机电系统麦克风、扬声器和受话器始终具有领导地位。同时Knowles也是应用于助听器和其他医疗器械的受话器及麦克风的领先供应商。此外，在电容器组件市场，也具有极高的占有率。
楼氏电子于1996年正式进入中国市场，致力于高质量的产品设计研发与生产，为客户提供创新的解决方案并发展合作共赢关系。近二十年来，楼氏紧随中国市场的发展，不断突破，成就卓越，目前在全国拥有4个分支机构，分别设在苏州、上海、北京和深圳。未来，楼氏电子将持续致力于成为完美声学以及高端电容器、数据和信号交换解决方案的创新者和领导者，引进能够成为行业标准的颠覆性技术，为客户提供更有效的解决方案。

公司因持续发展需增聘一批有才华，有能力，有责任心，有团队精神的高素质人才加盟楼氏，公司将为优秀的人才提供优厚的薪资待遇和海外培训机会。

请将简历发至keshr@knowles.com（注：请用英文标题，不要使用RAR文件）