苏州招聘

Job Purpose

? Secure design for manufacturability for semiconductor assembly and test production for new products meeting project goal such like time to market, quality, reliability, cost and manufacturing cycle time.
? Collaborates between the business units, Technology Development and the manufacturing organization to ensure manufacturability of new products into manufacturing.
Duties and Responsibilities

1) DFM (Design For Manufacturability) engineer in semiconductor assembly and test
? Drive New Package Introduction, DFM methodology improvement & manufacturing simplification
？ Verify Package, process, material design against manufacturability.
？ New packages design rule compliance verification
？ Identify and introduce Best known Practices
？ Simplify the production flow to reduce cycle time
？ Utilize DFM checklist
？ Drive continuous improvement: document learning’s & apply to new projects
？ Reduce duplication of effort between product lines & functional groups
2) Collaboration and coordination among business unit, wafer fab technology group, package development and Manufacturing groups
? Serve as a technical resource to resolve issues
? Eliminate potential hand-off issues after Code S deployment
3) Align Manufacturing technology requirements and capacity with support from PL’s, Technology, SCM and Finance
4) Defect to potential risk on process and design and fix it

Qualifications

? BS/MS Engineering Degree or equivalent
? Engineer with 5 to 10 years of semiconductor manufacturing experience
? Knowledge of Semiconductor package design/development
? Excellent verbal and written English communication skills

Working Conditions

？ Usually work a standard work week.
？ May be required to work some overtime hours such as urgent matter.

Physical Requirements

？ To be in good health and be able to take challenging work

我们公司主要负责世界500强欧美企业，且主要负责制造业：机械、电气、电子等行业；