苏州 [切换城市] 苏州招聘苏州工程/机械/能源招聘苏州工程/设备工程师招聘

Underfill Engineer ( 底封胶工程师-当前在招)

超威半导体技术(中国)有限公司

  • 公司性质:外资(欧美)
  • 公司行业:电子技术/半导体/集成电路

职位信息

  • 发布日期:2013-10-15
  • 工作地点:苏州-工业园区
  • 招聘人数:1
  • 工作经验:五年以上
  • 学历要求:本科
  • 语言要求:英语熟练
  • 职位类别:工程/设备工程师  

职位描述

Requirement:

1.Bachelor’s degree or above
2.5+ years’ working experience in engineering field, Underfill related experience is especially preferred.
3.Familiar with UF machine, Asymtek, Protec is preferred;
4.2+ years’ working experience of new product introduced;
5.Good English communication skill, need work with global engineering team;
6.Experience on tooling design is preferred;
7.Familiar with 6 sigma, QC tools, FMEA and other problem solving method
8.Basic knowledge in quality/EHS system.
9.Project management;
10.Basic knowledge and hands-on experience on Lean/ 5S


Responsibility:

1.Lead for process/equipment capability readiness for designed process/operation
2.Lead or work with cross functional team to conduct engineering evaluation and qualification for new product, equipment, material or process
3.Define operation standard, generate specification, working instruction for responsible process/operation
4.Initiate and establish statistical process control and control design of process and implement process control tools SPC, FMEA, Control Plan and APQP for responsible process/station.
5.Develop and establish training and troubleshooting programs on process and manufacturing
6.Monitor line process/equipment issues, analyze and initiate problem solving or providing engineering solutions.
7.Analyze the data and improve yield and quality continuously.
8.Customer issues investigations and correct actions implementation.
9.Waste identification and initiate project to improve productivity, equipment utilization and operation efficiency.
10.Other duties as assigned by supervisor.


公司介绍

AMD(NASDAQ: AMD)设计并集成尖端技术,为包括个人电脑、平板电脑、游戏机和云服务器等在内的数千万的智能设备提供强大动力,开启环绕计算的新时代。AMD解决方案让人们随时随地尽享其青睐的设备和应用的全部潜力,不断创造新的可能。
更多详情,敬请访问www.amd.com。

联系方式

  • Email:HR.SZ@amd.com