苏州招聘

Requirement：
1.Bachelor’s degree or above , 4+ years’ working experience in engineering field, IC assembly experience is preferred, flip chip related experience is especially preferred.
2.Be familiar with dicing, laser , wafer mount process and equipment
3.Be familiar the all kinds of die preparation material
4.Familiar with QC tools, FMEA and other problem solving method
5.Basic knowledge in quality/EHS system.
6.Basic knowledge and hands-on experience on Lean/ 5S
7.Good communication skill in both Chinese and English, good presentation skills
8.Teamwork, open mind and passionate,Independent, resourceful and takes initiative.

Responsibility：
1.Lead for die preparation area process/equipment capability readiness for designed process/operation,
2.Lead or work with cross functional team to conduct engineering evaluation and qualification for new product, equipment, material or process
3.Define operation standard, generate specification, working instruction for responsible process/operation
4.Initiate and establish statistical process control and control design of process and implement process control tools SPC, FMEA, Control Plan and APQP for responsible process/station.
5.Develop and establish training and troubleshooting programs on process and manufacturing
6.Monitor line process/equipment issues, analyze and initiate problem solving or providing engineering solutions , especially on laser trenching, dicing and wafer mounting etc..
7.Analyze the data and improve yield and quality continuously.
8.Customer issues investigations and correct actions implementation.
9.Waste identification and initiate project to improve productivity, equipment utilization and operation efficiency.
10.Other duties as assigned by supervisor.

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