苏州招聘

Requirement:
1;Bachelor’s degree in Electrical Engineering, or equivalent
2;4-8 years experience in electronic test (ATE, System Level Test, Functional Testing) and debugging digital and analog electronic circuits using laboratory equipment (oscilloscopes, logic analyzers, DMM, Curve tracer)
3;Demonstrated assertive leadership skills
4;Strong communication skills, both verbal and written
5;Effective time management skills, able to manage multiple open cases simultaneously
6;Proficient at problem solving and continuous improvement
7;Advanced working level knowledge of DOS, LINUX, JAVA & Windows, as well as PC systems and graphics processors
8;Knowledge of high-speed digital design, analog design, memory interface, bus (AGP, PCI, PCI-e) interface, ASIC verification, and applications engineering

Desired Skills/Experience:

1;ATE test experience (Scan Diagnostic, BIST, Analog, etc)
2;Understanding of fundamental Quality systems, Pareto analysis, 8D methodology
3;Knowledge or experience in Electronic Design and Test Methodology
4;Knowledge or experience in Platform debug/troubleshooting
5;Knowledge or experience in Surface Mount Technology, Printed Circuit Board Assembly, Advanced Packaging, Semiconductor Wafer Fabrication knowledge or experience
6;Knowledge or experience in Electrical fault isolation, silicon and package level physical failure analysis techniques, including SEM, EDX, TDR, X-Ray, C-SAM, FIB, TIVA, LIVA, Thermal Emission microscopy, Photon Emission Microscopy, IR microscopy, TRE, Laser Scanning microscopy

Job Description:

The Failure Analysis team within the Quality Engineering organization is responsible for analyzing failing ASICs and boards (GPUs/Chipsets) within required time frames, with the use of electrical test methods and physical FA as needed. The role of the Failure Analysis Engineer is to perform failure analysis on failed samples provided by external and internal customers to determine the root cause of the reported failures and work with appropriate technical owners on preventative and corrective actions to address the failures.

Responsibilities:

1;Lead and perform customer returns electrical debug (ATE, SLT, Diagnostics) to determine root cause analysis of failed ASICs and graphics boards/modules to performance standards within required timeframes
2;Document all analysis findings real-time as obtained into online LMS FA database
3;Where applicable, direct physical debug and/or die-level analysis as needed
4;After root cause determination, identify accountable issue owner (Systems Engineering, Product and Test Engineering, Diagnostic Engineering, S/W Engineering, CQE, Board Operations, Logistics, etc) and initiate request for corrective and preventative actions
5;Support internal and external customers to troubleshoot product failures for continuous yield improvement activities
6;If required, participate in customer calls on technical issues related to debug findings
7;Continuous improvement of debug processes and techniques

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