苏州招聘

Requirement:
1;Bachelor’s degree in Electrical Engineering, or equivalent
2;4-8 years experience in electronic test (ATE, System Level Test, Functional Testing) and debugging digital and analog electronic circuits using laboratory equipment (oscilloscopes, logic analyzers, DMM, Curve tracer)
3;Demonstrated assertive leadership skills
4;Strong communication skills, both verbal and written
5;Effective time management skills, able to manage multiple open cases simultaneously
6;Proficient at problem solving and continuous improvement
7;Advanced working level knowledge of DOS, LINUX, JAVA & Windows, as well as PC systems and graphics processors
8;Knowledge of high-speed digital design, analog design, memory interface, bus (AGP, PCI, PCI-e) interface, ASIC verification, and applications engineering
Desired Skills/Experience:
1;ATE test experience (Scan Diagnostic, BIST, Analog, etc)
2;Understanding of fundamental Quality systems, Pareto analysis, 8D methodology
3;Knowledge or experience in Electronic Design and Test Methodology
4;Knowledge or experience in Platform debug/troubleshooting
5;Knowledge or experience in Surface Mount Technology, Printed Circuit Board Assembly, Advanced Packaging, Semiconductor Wafer Fabrication knowledge or experience
6;Knowledge or experience in Electrical fault isolation, silicon and package level physical failure analysis techniques, including SEM, EDX, TDR, X-Ray, C-SAM, FIB, TIVA, LIVA, Thermal Emission microscopy, Photon Emission Microscopy, IR microscopy, TRE, Laser Scanning microscopy


Responsibilities:
1;Lead and perform customer returns electrical debug (ATE, SLT, Diagnostics) to determine root cause analysis of failed ASICs and graphics boards/modules to performance standards within required timeframes
2;Document all analysis findings real-time as obtained into online LMS FA database
3;Where applicable, direct physical debug and/or die-level analysis as needed
4;After root cause determination, identify accountable issue owner (Systems Engineering, Product and Test Engineering, Diagnostic Engineering, S/W Engineering, CQE, Board Operations, Logistics, etc) and initiate request for corrective and preventative actions
5;Support internal and external customers to troubleshoot product failures for continuous yield improvement activities
6;If required, participate in customer calls on technical issues related to debug findings
7;Continuous improvement of debug processes and techniques

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